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Growth Behavior Of Intermetallic Layer On Stainless Steel In Aluminum Hot-Dipping Process

Author

Listed:
  • YUANXING LI

    (School of Materials Science and Engineering, Southwest Jiaotong University, Chengdu 610031, P. R. China)

  • QIANG JIA

    (School of Materials Science and Engineering, Southwest Jiaotong University, Chengdu 610031, P. R. China)

  • ZONGTAO ZHU

    (School of Materials Science and Engineering, Southwest Jiaotong University, Chengdu 610031, P. R. China)

  • WEI GAO

    (School of Materials Science and Engineering, Southwest Jiaotong University, Chengdu 610031, P. R. China†Faculty of Engineering, The University of Auckland, BP 92019, Auckland 1142, New Zealand)

  • HUI CHEN

    (School of Materials Science and Engineering, Southwest Jiaotong University, Chengdu 610031, P. R. China)

Abstract

A set of stainless steel plates were treated by hot-dipping into molten pure aluminum (Al) at 700∘C, 760∘C and 820∘C with different immersion time from 10s to 1800s. The growth behavior of the intermetallic compound layers between the substrate and Al coating is investigated. The intermetallic compounds showed a bi-layer structure consisting of FeAl3 close to Al coating and Fe2Al5 close to the substrate. The thickness of the intermetallic layers is closely related to the immersion time. Crack occurred with increasing immersion time and thickening Fe2Al5 layer. The thickness of the Fe2Al5 layers increases linearly with the square root of immersion time. Phase’s identification of each layer was confirmed using X-ray diffraction (XRD) analysis by grinding the specimens to expose different layers. The Fe2Al5 layer exhibited a single intensive peak attributable to (002) plane. The full width half maximum (Δω) of Fe2Al5 on stainless steel substrate is 11.99∘ by X-ray rocking curve measurement, suggesting that the Fe2Al5 grains have a strong orientation texture but not a single crystal. For comparison, Δω of Fe2Al5 formed on mild steel by hot-dipping is 14.12∘. The relationship between the Δω of Fe2Al5 layers and the growth mechanisms of crystals is discussed for the two steel substrates.

Suggested Citation

  • Yuanxing Li & Qiang Jia & Zongtao Zhu & Wei Gao & Hui Chen, 2017. "Growth Behavior Of Intermetallic Layer On Stainless Steel In Aluminum Hot-Dipping Process," Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 24(04), pages 1-9, June.
    • Handle: RePEc:wsi:srlxxx:v:24:y:2017:i:04:n:s0218625x17500469
    DOI: 10.1142/S0218625X17500469
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