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Analysis Of Surface Roughness At Overlapping Laser Shock Peening

Author

Listed:
  • F. Z. DAI

    (School of Mechanical Engineering, Jiangsu University, Zhenjiang 212013, P. R. China†Jiangsu Key Lab of Photon Manufacturing Science and Technology, Jiangsu University, Zhenjiang 212013, P. R. China)

  • Z. D. ZHANG

    (School of Mechanical Engineering, Jiangsu University, Zhenjiang 212013, P. R. China†Jiangsu Key Lab of Photon Manufacturing Science and Technology, Jiangsu University, Zhenjiang 212013, P. R. China)

  • J. Z. ZHOU

    (School of Mechanical Engineering, Jiangsu University, Zhenjiang 212013, P. R. China†Jiangsu Key Lab of Photon Manufacturing Science and Technology, Jiangsu University, Zhenjiang 212013, P. R. China)

  • J. Z. LU

    (School of Mechanical Engineering, Jiangsu University, Zhenjiang 212013, P. R. China†Jiangsu Key Lab of Photon Manufacturing Science and Technology, Jiangsu University, Zhenjiang 212013, P. R. China)

  • Y. K. ZHANG

    (#x2021;School of Mechanical Engineering, Southeast University, Nanjing 211189, P. R. China)

Abstract

The overlapping effects on surface roughness are studied when samples are treated by laser shock peening (LSP). Surface roughness of overlapped circular laser spot is calculated by ISO 25178 height parameters. The usually used overlapping styles namely isosceles-right-triangle-style (AAP) and equilateral-triangle-style (AAA) are carefully investigated when the overlapping degree in x-axis (ηx) is below 50%. Surface roughness of isosceles-right-triangle-style attains its minimum value at ηx of 29.3%, and attains its maximum value at ηx of 43.6%. Surface roughness of equilateral-triangle-style attains its minimum value at ηx of 42.3%, and attains its maximum value at ηx of 32%. Experimental results are well consistent with theoretical analysis.

Suggested Citation

  • F. Z. Dai & Z. D. Zhang & J. Z. Zhou & J. Z. Lu & Y. K. Zhang, 2016. "Analysis Of Surface Roughness At Overlapping Laser Shock Peening," Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 23(03), pages 1-11, June.
    • Handle: RePEc:wsi:srlxxx:v:23:y:2016:i:03:n:s0218625x16500128
    DOI: 10.1142/S0218625X16500128
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