Author
Listed:
- MOHAMMAD REZA NASRESFAHANI
(Department of Materials Engineering, Isfahan University of Technology, Isfahan, 84156-83111, Iran)
- BEHZAD NIROUMAND
(Department of Materials Engineering, Isfahan University of Technology, Isfahan, 84156-83111, Iran)
- AHMAD KERMANPUR
(Department of Materials Engineering, Isfahan University of Technology, Isfahan, 84156-83111, Iran)
- MEHDI RAEISSI
(#x2020;Department of Materials Engineering, Faculty of Engineering, Shahrekord University, 88186-34141, Shahrekord, Iran)
Abstract
Modification of solidification structures by applying electric current has been the subject of interest in recent years. However, the exact relationships between the dendrite growth parameters and the current density are not yet clear. The dendrite tip geometry is an important growth parameter which can be characterized using the dendrite tip radius and the universal amplitude coefficient. In this paper, the dendrite tip shape was investigated in the absence and presence of an electric field using a transparent model material, i.e. the succinonitrile–acetone alloy. The results showed that both dendrite tip radius and universal amplitude coefficient increased by increasing the applied current density. The increase in the tip radius was attributed to the Joule heat produced at the solid–liquid interface which reduced the interface undercooling. The increase in the universal amplitude coefficient was postulated to be due to the changes in the distribution coefficient of the alloy system which would result in higher solute concentration in front of the solid–liquid interface. Owing to the increased universal amplitude coefficient, more prominent dendritic fins were observed at dendrites tips under electric current.
Suggested Citation
Mohammad Reza Nasresfahani & Behzad Niroumand & Ahmad Kermanpur & Mehdi Raeissi, 2016.
"Effects Of Applied Electric Current On The Tip Radius And The Universal Amplitude Coefficient Of A Single Growing Dendrite,"
Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 23(01), pages 1-8, February.
Handle:
RePEc:wsi:srlxxx:v:23:y:2016:i:01:n:s0218625x15500833
DOI: 10.1142/S0218625X15500833
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