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EFFECT OF pH ON THE ELECTRODEPOSITION OFCu(In,Al)Se2FROM AQUEOUS SOLUTION IN PRESENCE OF CITRIC ACID AS COMPLEXING AGENT

Author

Listed:
  • YADOLAH GANJKHANLOU

    (Materials and Energy Research Center, P.O. Box 14155-4777, Tehran, Iran)

  • TOURADJ EBADZADEH

    (Materials and Energy Research Center, P.O. Box 14155-4777, Tehran, Iran)

  • MAHMOOD KAZEMZAD

    (Materials and Energy Research Center, P.O. Box 14155-4777, Tehran, Iran)

  • AMIR MAGHSOUDIPOUR

    (Materials and Energy Research Center, P.O. Box 14155-4777, Tehran, Iran)

  • MANSOOR KIANPOUR-RAD

    (Materials and Energy Research Center, P.O. Box 14155-4777, Tehran, Iran)

Abstract

Effect of pH on the one-step electrodeposition ofCu(In,Al)Se2chalcopyrite layer in the presence of citric acid has been investigated by applying different electrochemical and characterization techniques. It has been observed that at pH of 1.5, nanocrystalline phase of chalcopyrite and small amount of binary phase ofCu2Sewith overall composition ofCu0.91In0.32Al0.39Se2have been deposited. On the other hand, at pH of 4, the film composition changed toCu1.9In0.05Al0.21Se2and an additional binary phase of copper selenide(CuSe)has also been formed. Morphological investigation illustrated that smooth and compact layer with fine spherical particles having the size of ~20 nm has been obtained at pH of 1.5 whereas mixture of planar and spherical particles with size of 450–550 nm have been formed at pH of 4. In alkaline environment (pH~9), the deposition current has been noticeably decreased and no deposition occurred due to the formation of a stable complex of citric acid with metal ions. The mechanism of citric acid interaction with metal ions at different pH has also been studied by cyclic voltammetry measurement.

Suggested Citation

  • Yadolah Ganjkhanlou & Touradj Ebadzadeh & Mahmood Kazemzad & Amir Maghsoudipour & Mansoor Kianpour-Rad, 2015. "EFFECT OF pH ON THE ELECTRODEPOSITION OFCu(In,Al)Se2FROM AQUEOUS SOLUTION IN PRESENCE OF CITRIC ACID AS COMPLEXING AGENT," Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 22(05), pages 1-6.
    • Handle: RePEc:wsi:srlxxx:v:22:y:2015:i:05:n:s0218625x15500572
    DOI: 10.1142/S0218625X15500572
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