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Laser-Induced Thermal–Mechanical Damage Characteristics Of Cleartran Multispectral Zinc Sulfide With Temperature-Dependent Properties

Author

Listed:
  • YAJING PENG

    (Department of Physics, Bohai University, Jinzhou 121000, P. R. China;
    State Key Laboratory of Explosion Science and Technology, Beijing Institute of Technology, Beijing 100081, P. R. China)

  • YANXUE JIANG

    (Department of Physics, Bohai University, Jinzhou 121000, P. R. China)

  • YANQIANG YANG

    (Department of Physics, Harbin Institute of Technology, Harbin 150001, P. R. China)

Abstract

Laser-induced thermal–mechanical damage characteristics of window materials are the focus problems in laser weapon and anti-radiation reinforcement technology. Thermal–mechanical effects and damage characteristics are investigated for cleartran multispectral zinc sulfide(ZnS)thin film window materials irradiated by continuous laser using three-dimensional (3D) thermal–mechanical model. Some temperature-dependent parameters are introduced into the model. The temporal-spatial distributions of temperature and thermal stress are exhibited. The damage mechanism is analyzed. The influences of temperature effect of material parameters and laser intensity on the development of thermal stress and the damage characteristics are examined. The results show, the von Mises equivalent stress along the thickness direction is fluctuant, which originates from the transformation of principal stresses from compressive stress to tensile stress with the increase of depth from irradiated surface. The damage originates from the thermal stress but not the melting. The thermal stress is increased and the damage is accelerated by introducing the temperature effect of parameters or the increasing laser intensity.

Suggested Citation

  • Yajing Peng & Yanxue Jiang & Yanqiang Yang, 2015. "Laser-Induced Thermal–Mechanical Damage Characteristics Of Cleartran Multispectral Zinc Sulfide With Temperature-Dependent Properties," Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 22(01), pages 1-9.
  • Handle: RePEc:wsi:srlxxx:v:22:y:2015:i:01:n:s0218625x15500146
    DOI: 10.1142/S0218625X15500146
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