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Effect Of Ultrasonic On Copper Electroplating From The Non-Cyanide Alkaline Baths

Author

Listed:
  • MINGGANG LI

    (College of Materials Science & Engineering, China Jiliang University, Hangzhou 310018, P. R. China)

  • SHUANGSHUANG HU

    (College of Materials Science & Engineering, China Jiliang University, Hangzhou 310018, P. R. China)

  • YEJIONG YANG

    (College of Materials Science & Engineering, China Jiliang University, Hangzhou 310018, P. R. China)

  • SHUHAN XU

    (College of Materials Science & Engineering, China Jiliang University, Hangzhou 310018, P. R. China)

  • XIXI ZHAO

    (College of Materials Science & Engineering, China Jiliang University, Hangzhou 310018, P. R. China)

  • GUOYING WEI

    (College of Materials Science & Engineering, China Jiliang University, Hangzhou 310018, P. R. China)

Abstract

Effects of the different ultrasonic powers on copper electrodeposition from non-cyanide alkaline baths by using pyrophosphate as complexing agent were investigated by different electrochemical methods. Cyclic voltammetry and current transient measurements were used to characterize the nucleation and growth mechanism. It is very obvious that the reduction potential moves to more positive one as the ultrasonic power increases. The quartz crystal microbalance (QCM) and chronoamperometric method were used to study the relationship between the mass change and the deposition time. It was found that the current efficiency of electrolyte under 0, 60, 80 and 100 W is 91.95%, 92.14%, 89.25% and 96.11%, respectively measured by QCM measurements. The surface morphology of the electrodepositedCufilms is analyzed by scanning electron microscopy (SEM). The morphology of copper films electrodeposited under the power of 60 W and 80 W presents a compact surface and the grains are fine and uniform.

Suggested Citation

  • Minggang Li & Shuangshuang Hu & Yejiong Yang & Shuhan Xu & Xixi Zhao & Guoying Wei, 2014. "Effect Of Ultrasonic On Copper Electroplating From The Non-Cyanide Alkaline Baths," Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 21(04), pages 1-6.
    • Handle: RePEc:wsi:srlxxx:v:21:y:2014:i:04:n:s0218625x14500577
    DOI: 10.1142/S0218625X14500577
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