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Copper Plating From Non-Cyanide Alkaline Baths

Author

Listed:
  • MINGGANG LI

    (College of Materials Science and Engineering, China Jiliang University, Hang Zhou 310018, P. R. China)

  • GUOYING WEI

    (College of Materials Science and Engineering, China Jiliang University, Hang Zhou 310018, P. R. China)

  • JIANFANG WANG

    (College of Materials Science and Engineering, China Jiliang University, Hang Zhou 310018, P. R. China)

  • MENG LI

    (College of Materials Science and Engineering, China Jiliang University, Hang Zhou 310018, P. R. China)

  • XIXI ZHAO

    (College of Materials Science and Engineering, China Jiliang University, Hang Zhou 310018, P. R. China)

  • YUZE BAI

    (Environmental Monitoring Station of Yangquan, Shanxi Province, P. R. China)

Abstract

Non-cyanide alkaline bath was used to prepare copper thin films. Influences of various temperatures on deposition rates, surface morphologies and microstructures of films were investigated. Copper thin films prepared from non-cyanide alkaline bath show typical nodular structures. Copper films fabricated at higher temperature possess rough surface due to hydrolysis of complexing agents. According to the XRD patterns, all deposited films were crystalline and showedCu(111),Cu(200) andCu(220) peaks. The intensity of peak (200) increases gradually with the rise on bath temperatures. Films with maximum thickness (7.5 μm) could be obtained at the temperature of 40°C. From the cyclic voltammetry curve, it was found that the cathodic polarization decreased slightly with increase of bath temperatures. In addition, when the bath temperature was equal to 50°C, current efficiency could reach to 96.95%.

Suggested Citation

  • Minggang Li & Guoying Wei & Jianfang Wang & Meng Li & Xixi Zhao & Yuze Bai, 2014. "Copper Plating From Non-Cyanide Alkaline Baths," Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 21(01), pages 1-7.
  • Handle: RePEc:wsi:srlxxx:v:21:y:2014:i:01:n:s0218625x14500097
    DOI: 10.1142/S0218625X14500097
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