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SIMULATION AND EXPERIMENTAL STUDIES ON SUBSTRATE TEMPERATURE AND GAS DENSITY FIELD IN HFCVD DIAMOND FILMS GROWTH ON WC–CoDRILL TOOLS

Author

Listed:
  • JIANGUO ZHANG

    (School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai 200240, P. R. China)

  • TAO ZHANG

    (School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai 200240, P. R. China)

  • XINCHANG WANG

    (School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai 200240, P. R. China)

  • BIN SHEN

    (School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai 200240, P. R. China)

  • FANGHONG SUN

    (School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai 200240, P. R. China)

Abstract

Uniform temperature and gas density field inside the reactor play an important role on synthesis of high-quality diamond films using hot filament chemical vapor deposition (HFCVD) method. In the present study, the finite volume method (FVM) is adopted to simulate the temperature and gas density distribution during the deposition process. Temperature–measuring experiments are conducted to verify the correctness of the simulation results. Thereafter, the deposition parameters are optimized using this model asD(filament separation) = 35 mm,H(filament–substrate distance) = -10 mm andN(number of gas inlet) = 3. Finally, experiments of depositing diamond films on WC–Codrill tools are carried out with the optimal deposition parameters. The results of the characterization by SEM and Raman spectrum exhibit that as-fabricated diamond-coated tools present a layer of high-quality diamond films with homogeneous surface and uniform thickness, further validating the accuracy of the parameter optimization using the simulation method.

Suggested Citation

  • Jianguo Zhang & Tao Zhang & Xinchang Wang & Bin Shen & Fanghong Sun, 2013. "SIMULATION AND EXPERIMENTAL STUDIES ON SUBSTRATE TEMPERATURE AND GAS DENSITY FIELD IN HFCVD DIAMOND FILMS GROWTH ON WC–CoDRILL TOOLS," Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 20(02), pages 1-10.
    • Handle: RePEc:wsi:srlxxx:v:20:y:2013:i:02:n:s0218625x13500200
    DOI: 10.1142/S0218625X13500200
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