Author
Listed:
- FERHAT BULBUL
(Mechanical Engineering, Ataturk University, Erzurum, +90/25240, Turkey)
- IHSAN EFEOGLU
(Mechanical Engineering, Ataturk University, Erzurum, +90/25240, Turkey)
Abstract
Engineering applications ofTiB2coatings are limited because of the brittle nature of interfacial bonds on the substrate surfaces, although they have many major properties such as high hardness, high wear and high temperature strength. To overcome this drawback, many researchers have studied over many years and their efforts have taken several forms such as the rotation of substrate, heating treatment during deposition or after deposition, application of positive bias voltage to the substrate, the introduction of transition elements as an interlayer, gradient or multilayer or composite strengthening, and the optimization studies performed by changing deposition process types and/or process parameters such as working gas and bias voltage. The purpose of this paper is to discuss these solutions proposed or developed by researchers against the limited use ofTiB2coatings due to its brittleness and low adhesion. From the results reported in literature, it is concluded that the best solution in order to produce non-brittleTiB2based film well adherent to substrate is the use of pulsed-dc deposition technology provided that the process parameters are tuned to give an appropriate composition and/or a coating design. Furthermore, theTiB2based coatings with multiphase layers seem to give better results respect to adherence.
Suggested Citation
Ferhat Bulbul & Ihsan Efeoglu, 2012.
"STRESS-RELIEF SOLUTIONS FOR BRITTLETiB2COATINGS,"
Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 19(04), pages 1-11.
Handle:
RePEc:wsi:srlxxx:v:19:y:2012:i:04:n:s0218625x1250045x
DOI: 10.1142/S0218625X1250045X
Download full text from publisher
As the access to this document is restricted, you may want to
for a different version of it.
Corrections
All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:wsi:srlxxx:v:19:y:2012:i:04:n:s0218625x1250045x. See general information about how to correct material in RePEc.
If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.
We have no bibliographic references for this item. You can help adding them by using this form .
If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.
For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: Tai Tone Lim (email available below). General contact details of provider: http://www.worldscinet.com/srl/srl.shtml .
Please note that corrections may take a couple of weeks to filter through
the various RePEc services.