IDEAS home Printed from https://ideas.repec.org/a/wsi/srlxxx/v19y2012i04ns0218625x12500370.html
   My bibliography  Save this article

EFFECT OF SUBSTRATE TEMPERATURE ON MICRO-STRUCTURAL PROPERTIES OFTiANDTiNFILMS DEPOSITED BY E-BEAM EVAPORATION TECHNIQUE

Author

Listed:
  • NISHAT ARSHI

    (School of Nano and Advanced Materials Engineering, Changwon National University, 9 Sarim dong Changwon-641-773, South Korea)

  • JUNQING LU

    (School of Nano and Advanced Materials Engineering, Changwon National University, 9 Sarim dong Changwon-641-773, South Korea)

  • BON HEUN KOO

    (School of Nano and Advanced Materials Engineering, Changwon National University, 9 Sarim dong Changwon-641-773, South Korea)

  • CHAN GYU LEE

    (School of Nano and Advanced Materials Engineering, Changwon National University, 9 Sarim dong Changwon-641-773, South Korea)

  • FAHEEM AHMED

    (School of Nano and Advanced Materials Engineering, Changwon National University, 9 Sarim dong Changwon-641-773, South Korea)

Abstract

We report the deposition ofTiandTiNfilms onSi/SiO2(100) substrate using e-beam evaporation technique. The influence of substrate temperature on the structural and morphological properties has been studied. The structure and morphology of the deposited films were analyzed by X-ray diffraction (XRD) and field emission scanning electron microscope (FESEM) measurements, respectively. XRD patterns reveal the FCC symmetry for both theTiandTiNfilms. The grain size of the films was found to increase with the increase in substrate temperature. FESEM micrographs showed a smooth morphology of the film with columnar grain structure.

Suggested Citation

  • Nishat Arshi & Junqing Lu & Bon Heun Koo & Chan Gyu Lee & Faheem Ahmed, 2012. "EFFECT OF SUBSTRATE TEMPERATURE ON MICRO-STRUCTURAL PROPERTIES OFTiANDTiNFILMS DEPOSITED BY E-BEAM EVAPORATION TECHNIQUE," Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 19(04), pages 1-7.
    • Handle: RePEc:wsi:srlxxx:v:19:y:2012:i:04:n:s0218625x12500370
    DOI: 10.1142/S0218625X12500370
    as

    Download full text from publisher

    File URL: http://www.worldscientific.com/doi/abs/10.1142/S0218625X12500370
    Download Restriction: Access to full text is restricted to subscribers
    File URL: https://libkey.io/10.1142/S0218625X12500370?utm_source=ideas
    LibKey link: if access is restricted and if your library uses this service, LibKey will redirect you to where you can use your library subscription to access this item
    ---><---

    As the access to this document is restricted, you may want to search for a different version of it.

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:wsi:srlxxx:v:19:y:2012:i:04:n:s0218625x12500370. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    We have no bibliographic references for this item. You can help adding them by using this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: Tai Tone Lim (email available below). General contact details of provider: http://www.worldscinet.com/srl/srl.shtml .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.