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THE EXPENDING RETROGRESSION TIME OF HOT-EXTRUDEDSc-CONTAININGAl–Zn–Mg–CuALLOY

Author

Listed:
  • SUNG-YONG SHIM

    (i-Cube Center, Engineering Research Institute, Gyeongsang National University, 900 Gazwadong, Jinju 660-701, Gyeongnam, Korea)

  • DAE-HWAN KIM

    (i-Cube Center, Engineering Research Institute, Gyeongsang National University, 900 Gazwadong, Jinju 660-701, Gyeongnam, Korea)

  • YOUNG-ROCK SUNG

    (i-Cube Center, Engineering Research Institute, Gyeongsang National University, 900 Gazwadong, Jinju 660-701, Gyeongnam, Korea)

  • IN-SHUP AHN

    (i-Cube Center, Engineering Research Institute, Gyeongsang National University, 900 Gazwadong, Jinju 660-701, Gyeongnam, Korea)

  • SU-GUN LIM

    (i-Cube Center, Engineering Research Institute, Gyeongsang National University, 900 Gazwadong, Jinju 660-701, Gyeongnam, Korea)

Abstract

In this paper, the retrogression and reaging (RRA) behavior and corrosion properties ofSc-containingAl–Zn–Mg–Cualloy were observed. The dependence of the mechanical properties and corrosion resistance on the heat treatment condition was measured by hardness, tensile, C-ring and conductivity testing. The retrogression time for recovery of the yield strength of the alloy subjected to T6 treatment was 20 min at 200°C of retrogression temperature, which was longer than that ofAl7075alloy. The results of electrical conductivity and C-ring tests showed that the stress corrosion cracking (SCC) resistance inSc-containing alloy treated for 20 min at 200°C was improved. These study results demonstrated the ability of theSc-containing alloy to extend the retrogression time and thereby improve the SCC resistance and mechanical properties.

Suggested Citation

  • Sung-Yong Shim & Dae-Hwan Kim & Young-Rock Sung & In-Shup Ahn & Su-Gun Lim, 2010. "THE EXPENDING RETROGRESSION TIME OF HOT-EXTRUDEDSc-CONTAININGAl–Zn–Mg–CuALLOY," Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 17(03), pages 293-298.
  • Handle: RePEc:wsi:srlxxx:v:17:y:2010:i:03:n:s0218625x10013734
    DOI: 10.1142/S0218625X10013734
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