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SiC-NANOPARTICLE DISPERSED COMPOSITE SOLDER BUMPS FABRICATED BY ELECTROPLATING

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  • YUE-SEON SHIN

    (Micro-Joining Center, Korea Institute of Industrial Technology, 7-47 Songdo-Dong, Yeonsu-Gu, Incheon 406-840, Korea)

  • YOUNG-KI KO

    (Micro-Joining Center, Korea Institute of Industrial Technology, 7-47 Songdo-Dong, Yeonsu-Gu, Incheon 406-840, Korea)

  • JUN-KI KIM

    (Micro-Joining Center, Korea Institute of Industrial Technology, 7-47 Songdo-Dong, Yeonsu-Gu, Incheon 406-840, Korea)

  • SEHOON YOO

    (Micro-Joining Center, Korea Institute of Industrial Technology, 7-47 Songdo-Dong, Yeonsu-Gu, Incheon 406-840, Korea)

  • CHANG-WOO LEE

    (Micro-Joining Center, Korea Institute of Industrial Technology, 7-47 Songdo-Dong, Yeonsu-Gu, Incheon 406-840, Korea)

Abstract

SiC-mixedSn–58Bicomposite solder bumps were successfully fabricated via an electroplating process. For the composite solder bump fabrication, ultrasonically dispersedSiCnanoparticles were added to the plating solutions. DSC analysis indicated that the melting temperature ofSiC-mixedSn–58Bisolders was the same as that of the non-mixedSn–58Bi. Shear strengths ofSn–58Bi+SiCsolder bumps were 6% higher than that of non-mixed solder bumps. The thicknesses of intermetallic compound were almost the same for bothSn–58BiandSn–58Bi+SiCsamples. TheSn–58Bi+SiCcomposite solder bumps had finer lamellar structures than non-mixedSn–58Bi. From the fracture surface analysis, fracture occurred at solder bump matrix, not at joint interface. Therefore, the addition of theSiCnanoparticles in theSn–58Bisolders decreased the grain sizes, which increased the shear strengths.

Suggested Citation

  • Yue-Seon Shin & Young-Ki Ko & Jun-Ki Kim & Sehoon Yoo & Chang-Woo Lee, 2010. "SiC-NANOPARTICLE DISPERSED COMPOSITE SOLDER BUMPS FABRICATED BY ELECTROPLATING," Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 17(02), pages 201-205.
    • Handle: RePEc:wsi:srlxxx:v:17:y:2010:i:02:n:s0218625x10013795
    DOI: 10.1142/S0218625X10013795
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