Author
Listed:
- XIANG YU
(School of Engineering and Technology, China University of Geosciences, 29 Xueyuan Road, Beijing 100083, China)
- CHENGBIAO WANG
(School of Engineering and Technology, China University of Geosciences, 29 Xueyuan Road, Beijing 100083, China)
- MENG HUA
(Manufacturing Engineering & Engineering Management Department, City University of Hong Kong, Tat Chee Avenue Kowloon, Hong Kong, China)
- PUILAM TAM
(Manufacturing Engineering & Engineering Management Department, City University of Hong Kong, Tat Chee Avenue Kowloon, Hong Kong, China)
- YANG LIU
(Beijing Powertech Co. Ltd., 63 Dongshanposanli Changxindian Fengtai, Beijing 100072, China)
- DEYANG YU
(Beijing Powertech Co. Ltd., 63 Dongshanposanli Changxindian Fengtai, Beijing 100072, China)
Abstract
An adherent nano-superhard titanium nitride (TiN) film on the substrate ofCr12Mo4Vhigh speed steel was prefabricated in a vacuum cathode multi-arc ion-plating system. Microhardness, film-to-substrate adhesion, and microstructure of the film were investigated typically using Vickers hardometer, scratch tester, and X-ray diffractometer. Results show that: (i) the achievable film microhardness is in the range of 35–45 GPa; (ii) the critical load (Lc) of the superhardTiNfilm is approximately 64 N; (iii) the nm scale mean main grain sizes of the film are approximately of 12.7 nm forTiN111, 19.7 nm forTiN200, and 9.6 nm forTiN220; and (iv) compared with the standardTiNfilm with the hardness of 22 GPa, the accomplishment of the nano-superhardTiNfilm may be due to (a) the ion bombardment induced residual stress within the film, and (b) the combined effect of the decrease of crystalline size and preferred orientation in the plane (111).
Suggested Citation
Xiang Yu & Chengbiao Wang & Meng Hua & Puilam Tam & Yang Liu & Deyang Yu, 2007.
"Adherent Nano-Superhard Titanium Nitride Film And Its Forming Mechanism In Multi-Arc Ion-Plating System,"
Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 14(04), pages 789-793.
Handle:
RePEc:wsi:srlxxx:v:14:y:2007:i:04:n:s0218625x07010275
DOI: 10.1142/S0218625X07010275
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