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Plating Of Copper Layers On Polyimides Using Electroless Plating By Surface Modification

Author

Listed:
  • EUN SUN JI

    (Department of Chemistry, Pukyong National University, 599-1 Daeyeon 3-dong, Nam-gu, Busan 608737, Korea)

  • YOUNG HWAN KIM

    (Department of Chemistry, Pukyong National University, 599-1 Daeyeon 3-dong, Nam-gu, Busan 608737, Korea)

  • YONG CHEOL KANG

    (Department of Chemistry, Pukyong National University, 599-1 Daeyeon 3-dong, Nam-gu, Busan 608737, Korea)

  • YOUNG SOO KANG

    (Department of Chemistry, Pukyong National University, 599-1 Daeyeon 3-dong, Nam-gu, Busan 608737, Korea)

  • BYUNG HYUN AHN

    (School of Material Science and Engineering, Pukyong National University, San 100, Yongdang-Dong, Nam-Gu, Busan 608739, Korea)

Abstract

This work describes electroless deposition of copper layers onto a polyimide (PI) film. The film was modified by etching with 1.0 M KOH solution treatment, and an activatedAgthin film was developed on this surface using 0.1 MAgNO3. TheCulayers were coated on the activated surface of polyimide films by electroless plating method. The thickness and surface morphology ofCulayers on the PI films were characterized with atomic force microscopy. The surface properties of PI film were identified with contact angle measurements.

Suggested Citation

  • Eun Sun Ji & Young Hwan Kim & Yong Cheol Kang & Young Soo Kang & Byung Hyun Ahn, 2007. "Plating Of Copper Layers On Polyimides Using Electroless Plating By Surface Modification," Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 14(04), pages 593-596.
    • Handle: RePEc:wsi:srlxxx:v:14:y:2007:i:04:n:s0218625x07009724
    DOI: 10.1142/S0218625X07009724
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