IDEAS home Printed from https://ideas.repec.org/a/wsi/srlxxx/v14y2007i01ns0218625x07009104.html
   My bibliography  Save this article

DEPOSITION AND CHARACTERIZATION OFTiN-COATED STEELS AT VARIOUSN2GAS FLOW RATES WITH CONSTANT ETCHING BY USING CAPVD TECHNIQUE

Author

Listed:
  • MUBARAK ALI

    (Department of Materials Engineering, Faculty of Mechanical Engineering, Universiti Teknologi Malaysia 81310, Skudai, Johor, Malaysia)

  • ESAH BINTI HAMZAH

    (Department of Materials Engineering, Faculty of Mechanical Engineering, Universiti Teknologi Malaysia 81310, Skudai, Johor, Malaysia)

  • MOHD RADZI HJ. MOHD TOFF

    (Advanced Materials Research Center (AMREC), SIRIM Berhad, Lot 34, Jalan Hi-Tech 2/3, Kulim Hi-Tech Park, 09000 Kulim, Kedah, Malaysia)

Abstract

Cathodic Arc Physical Vapor Deposition (CAPVD), a technique used for the deposition of hard coatings, for tooling applications, has many advantages. The main drawback of this technique is the formation of macrodroplets (MDs) during deposition, resulting in films with rougher morphology. Constant etching, by increasing nitrogen gas flow rate up to 200 sccm, helped in reducing the MD size and number; at higher rates, of say 300 sccm, the behavior was reversed. Minimum value of surface roughness recorded at 200 sccm was measured via both surface roughness tester and atomic force microscopy (AFM). Micro-Vickers hardness ofTiN-coated tool showed about 564% times increase in hardness than the uncoated one. Scratch tester was used to study the critical loads for the coating and the excellent adhesion achievable, of say 200 sccm, was demonstrated, with relevance to the various modes.

Suggested Citation

  • Mubarak Ali & Esah Binti Hamzah & Mohd Radzi Hj. Mohd Toff, 2007. "DEPOSITION AND CHARACTERIZATION OFTiN-COATED STEELS AT VARIOUSN2GAS FLOW RATES WITH CONSTANT ETCHING BY USING CAPVD TECHNIQUE," Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 14(01), pages 93-100.
  • Handle: RePEc:wsi:srlxxx:v:14:y:2007:i:01:n:s0218625x07009104
    DOI: 10.1142/S0218625X07009104
    as

    Download full text from publisher

    File URL: http://www.worldscientific.com/doi/abs/10.1142/S0218625X07009104
    Download Restriction: Access to full text is restricted to subscribers

    File URL: https://libkey.io/10.1142/S0218625X07009104?utm_source=ideas
    LibKey link: if access is restricted and if your library uses this service, LibKey will redirect you to where you can use your library subscription to access this item
    ---><---

    As the access to this document is restricted, you may want to search for a different version of it.

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:wsi:srlxxx:v:14:y:2007:i:01:n:s0218625x07009104. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    We have no bibliographic references for this item. You can help adding them by using this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: Tai Tone Lim (email available below). General contact details of provider: http://www.worldscinet.com/srl/srl.shtml .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.