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GROWTH KINETICS OFCu(Al)SOLID SOLUTION INAl/CuDIFFUSION COUPLES

Author

Listed:
  • E. B. HANNECH

    (Physics Department, LESIMS, University of Annaba, BP 12 Annaba, Algeria)

  • N. LAMOUDI

    (Physics Department, LESIMS, University of Annaba, BP 12 Annaba, Algeria)

  • A. GASMI

    (Physics Department, LESIMS, University of Annaba, BP 12 Annaba, Algeria)

Abstract

The growth kinetics of the solid solution phase of aluminum in copper in diffusion couples of pure aluminum and copper has been investigated at 425°C using a scanning electron microscope. In the initial stage, the phase layer growth was found to obey the parabolic law, indicating that the rate-controlling process is diffusion. At longer times, the growth rate deviates from thekt-1/2behavior of the early stage.

Suggested Citation

  • E. B. Hannech & N. Lamoudi & A. Gasmi, 2004. "GROWTH KINETICS OFCu(Al)SOLID SOLUTION INAl/CuDIFFUSION COUPLES," Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 11(03), pages 337-340.
    • Handle: RePEc:wsi:srlxxx:v:11:y:2004:i:03:n:s0218625x04006232
    DOI: 10.1142/S0218625X04006232
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