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Studies ofAg/FeInterfacial Free Energies by Biaxial Zero Creep Experiments

Author

Listed:
  • Bing An

    (State Key Laboratory of Plastic Forming Simulation and Die & Mould Technology, Huazhong University of Science and Technology, Wuhan, 430074, China)

  • Tong-Jun Zhang

    (State Key Laboratory of Plastic Forming Simulation and Die & Mould Technology, Huazhong University of Science and Technology, Wuhan, 430074, China)

  • Chao Yuan

    (State Key Laboratory of Plastic Forming Simulation and Die & Mould Technology, Huazhong University of Science and Technology, Wuhan, 430074, China)

  • Kun Cui

    (State Key Laboratory of Plastic Forming Simulation and Die & Mould Technology, Huazhong University of Science and Technology, Wuhan, 430074, China)

Abstract

Biaxial zero creep experiments based on the Josell model were performed onAg/Femultilayer thin films to determine their interfacial free energies. Various multilayer samples on stiff wafers prepared by RF magnetron sputtering were subjected to annealing of long duration at 550°C, while a substrate curvature technique was employed for real-time film stress monitoring. Sufficient plastic flow in films makes possible a zero creep equilibrium state to present during this isothermal process, and as a result the interfacial free energies in multilayer interfaces are equilibrated with the elastic strain energies arising from the substrate bending. There is no collapse in the annealed multilayer structures. They are still stably layer-built and exhibit a column grain distribution. XRD results show thatAgandFelayers have (111) and (110) preferred orientations, respectively. In accordance with a revised Josell model, the equilibrium stresses were measured and theAg(111)/Fe(110)interface free energy at 550°C was found to be0.97 ± 0.13J/m2.

Suggested Citation

  • Bing An & Tong-Jun Zhang & Chao Yuan & Kun Cui, 2003. "Studies ofAg/FeInterfacial Free Energies by Biaxial Zero Creep Experiments," Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 10(05), pages 763-769.
  • Handle: RePEc:wsi:srlxxx:v:10:y:2003:i:05:n:s0218625x03005554
    DOI: 10.1142/S0218625X03005554
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