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Investigation Of The Interface Of The Dcb Substrate

Author

Listed:
  • HONGLONG NING

    (Department of Materials Science & Engineering, Tsinghua University, Beijing 100084, China)

  • USHENG MA

    (Department of Materials Science & Engineering, Tsinghua University, Beijing 100084, China)

  • FUXIANG HUANG

    (Department of Materials Science & Engineering, Tsinghua University, Beijing 100084, China)

  • YONGGANG WANG

    (Department of Materials Science & Engineering, Tsinghua University, Beijing 100084, China)

  • JIMAN ZHU

    (Department of Materials Science & Engineering, Tsinghua University, Beijing 100084, China)

  • ZHITING GENG

    (Department of Materials Science & Engineering, Tsinghua University, Beijing 100084, China)

Abstract

DCB means direct copper bonding and denotes a process in which copper and a ceramic material are directly bonded. Between the temperature of the metal's melting point and the eutectic temperature of the metal-oxygen, DCB depends on the eutectic compound to join the copper and the ceramic. We do some research to investigate the interface between the copper foils and Al2O3ceramics; it is the key factor in influencing the performance of the DCB substrate. We also discuss how to get good microstructure of the DCB interface.

Suggested Citation

  • Honglong Ning & Usheng Ma & Fuxiang Huang & Yonggang Wang & Jiman Zhu & Zhiting Geng, 2003. "Investigation Of The Interface Of The Dcb Substrate," Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 10(01), pages 95-99.
    • Handle: RePEc:wsi:srlxxx:v:10:y:2003:i:01:n:s0218625x03004640
    DOI: 10.1142/S0218625X03004640
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