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CLEAN AND OXYGEN-COVEREDCu3Au(110): A SURFACE STRUCTURE INVESTIGATION WITH STM AND NICISS

Author

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  • HORST NIEHUS

    (Humboldt-Universität zu Berlin, Institut für Physik, Oberflächenphysik and Atomstoßprozesse, Invalidenstr. 110, D10115 Berlin, Forschungszentrum Jülich, Germany)

  • THOMAS BAUMANN

    (Humboldt-Universität zu Berlin, Institut für Physik, Oberflächenphysik and Atomstoßprozesse, Invalidenstr. 110, D10115 Berlin, Forschungszentrum Jülich, Germany)

  • MATTHIAS VOETZ

    (Institut für Grenzflächenforschung und Vakuumphysik, KFA Jülich, D52425 Jülich, Germany)

  • KARINA MORGENSTERN

    (Institut für Grenzflächenforschung und Vakuumphysik, KFA Jülich, D52425 Jülich, Germany)

Abstract

Cu3Au(110)has been investigated by scanning tunneling microscopy (STM) and 180° low energy ion scattering and detection of neutrals (NICISS). Two different terminations would be possible on the basis of a bulk-truncated surface, a gold-rich or a pure copper surface layer. From the NICISS investigation the gold-rich termination has been found. Two surface modifications could be prepared. Rapid cool-down after annealing at 800 K results in a2×1LEED superstructure, but careful preparation and prolonged cooling below 600 K gives a LEED4×1superstructure. A new pairing row model has been proposed. Upon oxygen exposure at 330 K on the quenched2×1surface and subsequent annealing at 800 K, a2×1LEED superstructure presents itself with considerably sharper half order reflexes. NICISS data propose a segregation of Cu atoms to the surface layer forming -Cu-O- rows just above the Cu rows in theAu-rich layer. The2×1superstructure formed is in part similar to the well-known added row structure atCu(110)-(2×1)-O. The structure model has been verified by direct imaging of the added rows with STM.

Suggested Citation

  • Horst Niehus & Thomas Baumann & Matthias Voetz & Karina Morgenstern, 1996. "CLEAN AND OXYGEN-COVEREDCu3Au(110): A SURFACE STRUCTURE INVESTIGATION WITH STM AND NICISS," Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 3(05n06), pages 1899-1908.
    • Handle: RePEc:wsi:srlxxx:v:03:y:1996:i:05n06:n:s0218625x96002813
    DOI: 10.1142/S0218625X96002813
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