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STRUCTURE OFCu-AuALLOY NANOSCALE PARTICLES AND THE PHASE TRANSFORMATION

Author

Listed:
  • T. TADAKI

    (The Institute of Scientific and Industrial Research, Osaka University, 8–1 Mihoga-oka, Ibaraki, Osaka 567, Japan)

  • A. KOREEDA

    (The Institute of Scientific and Industrial Research, Osaka University, 8–1 Mihoga-oka, Ibaraki, Osaka 567, Japan)

  • Y. NAKATA

    (The Institute of Scientific and Industrial Research, Osaka University, 8–1 Mihoga-oka, Ibaraki, Osaka 567, Japan)

  • T. KINOSHITA

    (The Institute of Scientific and Industrial Research, Osaka University, 8–1 Mihoga-oka, Ibaraki, Osaka 567, Japan)

Abstract

Atomic structure of nanoscale particles of aCu-Aualloy with a nominal compositionCu3Auand the phase transformation therein are studied by means of high-resolution electron microscopy and electron diffraction. The particles 8.8 nm in diameter on average prepared by simultaneous vacuum deposition of the constituent elements exhibit as a whole an fcc structure of an alloy with a composition of 26.4 at.% Au. The alloy particles are ordered into theL12-type superlattice structure when heat-treated at 563 K for 1 h. The superlattice reflections disappear upon heating up to 773 K. In a particle about 10 nm in size an antiphase domain boundary is observed. It thus appears that the nanoscale particles of the alloy undergo the order-disorder transition, as in the bulk. However, the critical temperatureTcfor the order-disorder transition of the nanoscale particles is found to be by about 90 K lower than that of the bulk. The minimum size of the alloy particles in which lattice fringes whose spacing corresponds to the interplanar spacing of the {100}-type superlattice planes are observed is about 4 nm. These facts suggest that a certain critical size and size effects are present for atomic ordering in the Cu-Au alloy particles.

Suggested Citation

  • T. Tadaki & A. Koreeda & Y. Nakata & T. Kinoshita, 1996. "STRUCTURE OFCu-AuALLOY NANOSCALE PARTICLES AND THE PHASE TRANSFORMATION," Surface Review and Letters (SRL), World Scientific Publishing Co. Pte. Ltd., vol. 3(01), pages 65-69.
  • Handle: RePEc:wsi:srlxxx:v:03:y:1996:i:01:n:s0218625x96000152
    DOI: 10.1142/S0218625X96000152
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