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Effect of PCM-filled hallow fin heat sink for cooling of electronic components — a numerical approach for thermal management perspective

Author

Listed:
  • Sandeep Ohol

    (Department of Mechanical Engineering, MIT School of Engineering, MIT Art, Design and Technology University, Pune 412201, Maharashtra, India)

  • V. K. Mathew

    (Protean Tech Services, Hadapsar, Pune 411028, Maharashtra, India)

  • Virendra Bhojwani

    (Department of Mechanical Engineering, MIT School of Engineering, MIT Art, Design and Technology University, Pune 412201, Maharashtra, India)

  • Naveen G. Patil

    (Varroc Engineering Limited, Pune 411033, India)

  • Praveen Barmavatu

    (Department of Mechanical Engineering, Faculty of Engineering, Universidad Tecnológica Metropolitana, Av. José Pedro Alessandri 1242, Santiago 7800002, Chile)

Abstract

This paper aims at the PCM-based heat sink for electronic cooling. In the present analysis, paraffin wax-based phase change material (PCM), in 3-fin and 4-fin hollow heat sinks with the proper volume of PCM in the temperature of the electronic components can be controlled. The PCM-filled heat sinks are placed on top of the high heat-generating integrated circuit (IC) components. The aim is to reduce the maximum temperature of the electronic components and keep them below their critical temperature, hence increasing the life of the IC chips. A correlation is put forward for dimensionless temperature (θ) in terms of heat flux (q∗), volume content (v∗) and size of the IC chips (δ). It has been found that there will be a 4–6∘C drop in temperature when compared to solid fins heat sinks. It is confirmed that the temperature of the IC chip is a strong function of heat flux, size and volume content of PCM.

Suggested Citation

  • Sandeep Ohol & V. K. Mathew & Virendra Bhojwani & Naveen G. Patil & Praveen Barmavatu, 2024. "Effect of PCM-filled hallow fin heat sink for cooling of electronic components — a numerical approach for thermal management perspective," International Journal of Modern Physics C (IJMPC), World Scientific Publishing Co. Pte. Ltd., vol. 35(10), pages 1-13, October.
    • Handle: RePEc:wsi:ijmpcx:v:35:y:2024:i:10:n:s0129183124501225
    DOI: 10.1142/S0129183124501225
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