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Validation experiments for LBM simulations of electron beam melting

Author

Listed:
  • Regina Ammer

    (Department of Computer Science 10 System Simulation, University of Erlangen-Nuremberg, Cauerstr. 11, 91058 Erlangen, Germany)

  • Ulrich Rüde

    (Department of Computer Science 10 System Simulation, University of Erlangen-Nuremberg, Cauerstr. 11, 91058 Erlangen, Germany)

  • Matthias Markl

    (Chair of Metals Science and Technology, University of Erlangen-Nuremberg, Martensstr. 5, 91058 Erlangen, Germany)

  • Vera Jüchter

    (Chair of Metals Science and Technology, University of Erlangen-Nuremberg, Martensstr. 5, 91058 Erlangen, Germany)

  • Carolin Körner

    (Chair of Metals Science and Technology, University of Erlangen-Nuremberg, Martensstr. 5, 91058 Erlangen, Germany)

Abstract

This paper validates three-dimensional (3D) simulation results of electron beam melting (EBM) processes by comparing experimental and numerical data. The physical setup is presented which is discretized by a 3D thermal lattice Boltzmann method (LBM). An experimental process window is used for the validation depending on the line energy injected into the metal powder bed and the scan velocity of the electron beam. In the process window, the EBM products are classified into the categories, porous, good and swelling, depending on the quality of the surface. The same parameter sets are used to generate a numerical process window. A comparison of numerical and experimental process windows shows a good agreement. This validates the EBM model and justifies simulations for future improvements of the EBM processes. In particular, numerical simulations can be used to explain future process window scenarios and find the best parameter set for a good surface quality and dense products.

Suggested Citation

  • Regina Ammer & Ulrich Rüde & Matthias Markl & Vera Jüchter & Carolin Körner, 2014. "Validation experiments for LBM simulations of electron beam melting," International Journal of Modern Physics C (IJMPC), World Scientific Publishing Co. Pte. Ltd., vol. 25(12), pages 1-9.
    • Handle: RePEc:wsi:ijmpcx:v:25:y:2014:i:12:n:s0129183114410095
    DOI: 10.1142/S0129183114410095
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