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Thermal Stress of Surface of Mold Cavities and Parting Line of Silicone Molds

Author

Listed:
  • Beznák Matej

    (CSc. – Faculty of Materials Science and Technology in Trnava, Slovak University of Technology Bratislava)

  • Mäsiar Harold

    (CSc. – Alexander Dubček University of Trenčín)

Abstract

The paper is focused on the study of thermal stress of surface of mold cavities and parting line of silicone molds after pouring. The silicone mold White SD - THT was thermally stressed by pouring of ZnAl4Cu3 zinc alloy with pouring cycle 20, 30 and 40 seconds. The most thermally stressed part of surface at each pouring cycle is gating system and mold cavities. It could be further concluded that linear increase of the pouring cycle time leads to the exponential increasing of the maximum temperature of mold surface after its cooling. The elongated pouring cycle increases the temperature accumulated on the surface of cavities and the ability of silicone mold to conduct the heat on its surface decreases, because the low thermal conductivity of silicone molds enables the conduction of larger amount of heat into ambient environment.

Suggested Citation

  • Beznák Matej & Mäsiar Harold, 2014. "Thermal Stress of Surface of Mold Cavities and Parting Line of Silicone Molds," Research Papers Faculty of Materials Science and Technology Slovak University of Technology, Sciendo, vol. 22(34), pages 1-8, June.
    • Handle: RePEc:vrs:repfms:v:22:y:2014:i:34:p:8:n:1
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