IDEAS home Printed from https://ideas.repec.org/a/taf/uiiexx/v51y2019i2p124-135.html
   My bibliography  Save this article

Theoretical modelling and prediction of surface roughness for hybrid additive–subtractive manufacturing processes

Author

Listed:
  • Lin Li
  • Azadeh Haghighi
  • Yiran Yang

Abstract

Hybrid additive–subtractive manufacturing processes are becoming increasingly popular as a promising solution to overcome the current limitations of Additive Manufacturing (AM) technology and improve the dimensional accuracy and surface quality of parts. Surface roughness, as one of the most important surface quality measures, plays a key role in the fit of assemblies and thus needs to be thoroughly evaluated at the design and manufacturing stages. However, most of the studies on surface roughness modelling and analysis employ empirical approaches, and only consider the effect of a single manufacturing process. In particular, the existing surface roughness models are not applicable to hybrid additive–subtractive manufacturing processes in which a secondary process is involved. In this article, analytical models are established to predict the surface roughness of parts fabricated by AM as well as hybrid additive–subtractive manufacturing processes. A novel surface profile representation scheme is also proposed to increase the prediction accuracy. Case studies are performed to validate the effectiveness of the proposed models. An average of 4.25% error is observed for the AM case, which is significantly smaller than the prediction error of the existing models in the literature. Furthermore, in the hybrid case, an average of 91.83% accuracy is obtained.

Suggested Citation

  • Lin Li & Azadeh Haghighi & Yiran Yang, 2019. "Theoretical modelling and prediction of surface roughness for hybrid additive–subtractive manufacturing processes," IISE Transactions, Taylor & Francis Journals, vol. 51(2), pages 124-135, February.
  • Handle: RePEc:taf:uiiexx:v:51:y:2019:i:2:p:124-135
    DOI: 10.1080/24725854.2018.1458268
    as

    Download full text from publisher

    File URL: http://hdl.handle.net/10.1080/24725854.2018.1458268
    Download Restriction: Access to full text is restricted to subscribers.

    File URL: https://libkey.io/10.1080/24725854.2018.1458268?utm_source=ideas
    LibKey link: if access is restricted and if your library uses this service, LibKey will redirect you to where you can use your library subscription to access this item
    ---><---

    As the access to this document is restricted, you may want to search for a different version of it.

    More about this item

    Statistics

    Access and download statistics

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:taf:uiiexx:v:51:y:2019:i:2:p:124-135. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    We have no bibliographic references for this item. You can help adding them by using this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: Chris Longhurst (email available below). General contact details of provider: http://www.tandfonline.com/uiie .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.