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Experimental investigation and analysis of EMI in stacked I/O connectors of PCB

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  • H.-H. Chou
  • Y.-S. Lee

Abstract

The electromagnetic interference (EMI) caused by the noise resulting from a common mode of stacked I/O connectors is analyzed using both numerical simulation and experimental measurements. The use of stacked connectors exists on the PCBs of today’s information technology equipment in order to reduce size; however, size reductions will cause increased severe EMI. After diagnosis and analysis, a strategy is presented to suppress the EMI noise level, as well as its emissions, and is found to be very effective as shown by our experiments.

Suggested Citation

  • H.-H. Chou & Y.-S. Lee, 2016. "Experimental investigation and analysis of EMI in stacked I/O connectors of PCB," Journal of Electromagnetic Waves and Applications, Taylor & Francis Journals, vol. 30(2), pages 195-206, January.
    • Handle: RePEc:taf:tewaxx:v:30:y:2016:i:2:p:195-206
    DOI: 10.1080/09205071.2015.1099477
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