3D package-integrated artificial magnetic conductor antenna arrays for 60 GHz transceivers

We present a low-profile design of dipole antenna arrays integrated on a planar artificial magnetic conductor (AMC) based on spiral unit cells. The whole system is designed and manufactured on a multi-layer organic laminate packaging technology and can be integrated with a single-chip 60-GHz radio transceiver die. We analyze two fabricated arrays of different total area both of which contain 16 elements fed through a combiner network exciting the array elements either in phase or for 45° scan angle. The integrated antenna-AMC array element presented has twice the impedance bandwidth necessary to cover all international 60-GHz radio bands, small form factor suitable for on-package integration, and 5 dBi gain including all losses. The larger 16-element array, occupying 11 × 11 mm2 package area, has a measured gain of 17 dBi at broadside and 15 dBi at 45° scan angle, while the smaller array, occupying a 6.6 × 11 mm2 package area, has a gain of 15 dBi at broadside and 14 dBi at a 45° scan angle. These arrays are an ideal 3D-integrated package solution for 60 GHz radio transceivers.