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The effect of thermal stress on crack-inclusion problem in inhomogeneous superconducting cylinder

Author

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  • Yufeng Zhao

    (Lanzhou University of Technology)

  • Yifan Yang

    (Lanzhou University of Technology)

Abstract

In this paper, the effect of thermal stress on crack-inclusion problem in inhomogeneous superconducting cylinder in the cooling process is investigated. By using the gradient finite element method, the thermodynamic coupling equation is solved numerically and the thermal stress is obtained during the drop from room temperature to operating temperature. Then the stress intensity factors for the cooling process are solved. The effects of thermal stress on crack growth are discussed, and the effects of the inclusion on crack growth under thermal stress are analyzed. According to the results, the crack length increases to promote the crack growth, then the effect of thermal stress on the crack growth increases as the crack length increases. In addition, the size and type of the inclusion, as well as the distance of the inclusion from the crack tip, can also affect the crack extension. Graphical Abstract Sketch of an inhomogeneous superconducting cylinder containing a crack and an inclusion. Mesh around the crack tip and the inclusion. Variation of $$K_{1} /K_{0}$$ K 1 / K 0 with time in the cooling process

Suggested Citation

  • Yufeng Zhao & Yifan Yang, 2023. "The effect of thermal stress on crack-inclusion problem in inhomogeneous superconducting cylinder," The European Physical Journal B: Condensed Matter and Complex Systems, Springer;EDP Sciences, vol. 96(11), pages 1-10, November.
    • Handle: RePEc:spr:eurphb:v:96:y:2023:i:11:d:10.1140_epjb_s10051-023-00619-7
    DOI: 10.1140/epjb/s10051-023-00619-7
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