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Single-step deposition of high-mobility graphene at reduced temperatures

Author

Listed:
  • D.A. Boyd

    (California Institute of Technology)

  • W.-H. Lin

    (California Institute of Technology)

  • C.-C. Hsu

    (California Institute of Technology
    Institute of Quantum Information and Matter, California Institute of Technology)

  • M.L. Teague

    (California Institute of Technology
    Institute of Quantum Information and Matter, California Institute of Technology)

  • C.-C. Chen

    (California Institute of Technology
    Institute of Quantum Information and Matter, California Institute of Technology)

  • Y.-Y. Lo

    (Graduate Institute of Photonics and Optoelectronics, National Taiwan University)

  • W.-Y. Chan

    (Institute of Physics, Academia Sinica, Nankang)

  • W.-B. Su

    (Institute of Physics, Academia Sinica, Nankang)

  • T.-C. Cheng

    (Graduate Institute of Photonics and Optoelectronics, National Taiwan University)

  • C.-S. Chang

    (Institute of Physics, Academia Sinica, Nankang)

  • C.-I. Wu

    (Graduate Institute of Photonics and Optoelectronics, National Taiwan University)

  • N.-C. Yeh

    (California Institute of Technology
    Institute of Quantum Information and Matter, California Institute of Technology
    Kavli Nanoscience Institute, California Institute of Technology)

Abstract

Current methods of chemical vapour deposition (CVD) of graphene on copper are complicated by multiple processing steps and by high temperatures required in both preparing the copper and inducing subsequent film growth. Here we demonstrate a plasma-enhanced CVD chemistry that enables the entire process to take place in a single step, at reduced temperatures (

Suggested Citation

  • D.A. Boyd & W.-H. Lin & C.-C. Hsu & M.L. Teague & C.-C. Chen & Y.-Y. Lo & W.-Y. Chan & W.-B. Su & T.-C. Cheng & C.-S. Chang & C.-I. Wu & N.-C. Yeh, 2015. "Single-step deposition of high-mobility graphene at reduced temperatures," Nature Communications, Nature, vol. 6(1), pages 1-8, May.
    • Handle: RePEc:nat:natcom:v:6:y:2015:i:1:d:10.1038_ncomms7620
    DOI: 10.1038/ncomms7620
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