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Vanadium dioxide nanowire-based microthermometer for quantitative evaluation of electron beam heating

Author

Listed:
  • H. Guo

    (University of California
    National Center for Electron Microscopy, Molecular Foundry, Lawrence Berkeley National Laboratory)

  • M. I. Khan

    (University of California)

  • C. Cheng

    (University of California
    Present address: Department of Materials Science and Engineering, South University of Science and Technology, Shenzhen 518055, China)

  • W. Fan

    (University of California)

  • C. Dames

    (University of California)

  • J. Wu

    (University of California)

  • A. M. Minor

    (University of California
    National Center for Electron Microscopy, Molecular Foundry, Lawrence Berkeley National Laboratory)

Abstract

Temperature measurement is critical for many technological applications and scientific experiments, and different types of thermometers have been developed to detect temperature at macroscopic length scales. However, quantitative measurement of the temperature of nanostructures remains a challenge. Here, we show a new type of microthermometer based on a vanadium dioxide nanowire. Its mechanism is derived from the metal–insulator transition of vanadium dioxide at 68 °C. As our results demonstrate, this microthermometer can serve as a thermal flow meter to investigate sample heating from the incident electron beam using a transmission electron microscope. Owing to its small size the vanadium dioxide nanowire-based microthermometer has a large measurement range and high sensitivity, making it a good candidate to explore the temperature environment of small spaces or to monitor the temperature of tiny, nanoscale objects.

Suggested Citation

  • H. Guo & M. I. Khan & C. Cheng & W. Fan & C. Dames & J. Wu & A. M. Minor, 2014. "Vanadium dioxide nanowire-based microthermometer for quantitative evaluation of electron beam heating," Nature Communications, Nature, vol. 5(1), pages 1-5, December.
  • Handle: RePEc:nat:natcom:v:5:y:2014:i:1:d:10.1038_ncomms5986
    DOI: 10.1038/ncomms5986
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