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Efficient thermal management of electronic devices by constructing interlayer phonon bridges

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  • Gaojie Han

    (Zhengzhou University, State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, National Engineering Research Center for Advanced Polymer Processing Technology)

  • Hongli Cheng

    (Zhengzhou University, State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, National Engineering Research Center for Advanced Polymer Processing Technology)

  • Yuezhan Feng

    (Zhengzhou University, State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, National Engineering Research Center for Advanced Polymer Processing Technology)

  • Shiliang Zhang

    (Huazhong University of Science and Technology, State Key Laboratory of New Textile Materials and Advanced Processing, Research Center for Intelligent Fiber Devices and Equipment, School of Materials Science and Engineering and School of Physical Education
    Huazhong University of Science and Technology, Department of Geriatrics and Key Laboratory of Vascular Aging, Ministry of Education, Tongji Hospital of Tongji Medical College)

  • Jingwen Dong

    (Zhengzhou University, State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, National Engineering Research Center for Advanced Polymer Processing Technology)

  • Bing Zhou

    (Zhengzhou University, State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, National Engineering Research Center for Advanced Polymer Processing Technology)

  • Xianhu Liu

    (Zhengzhou University, State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, National Engineering Research Center for Advanced Polymer Processing Technology)

  • Chuntai Liu

    (Zhengzhou University, State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, National Engineering Research Center for Advanced Polymer Processing Technology)

  • Guangming Tao

    (Huazhong University of Science and Technology, State Key Laboratory of New Textile Materials and Advanced Processing, Research Center for Intelligent Fiber Devices and Equipment, School of Materials Science and Engineering and School of Physical Education
    Huazhong University of Science and Technology, Department of Geriatrics and Key Laboratory of Vascular Aging, Ministry of Education, Tongji Hospital of Tongji Medical College
    Central China Normal University, Center for Intelligent Health Interdisciplinary Science)

  • Changyu Shen

    (Zhengzhou University, State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, National Engineering Research Center for Advanced Polymer Processing Technology)

Abstract

Layered film-based thermal management materials with high in-plane thermal conductivity can effectively diffuse point heat sources and prevent local overheating. However, their low through-plane thermal conductivity limits its overall heat dissipation. Here, we introduce a honeycomb-gel densification strategy that forms zigzag yet continuous interlayer phonon bridges within the layered structure. This design establishes bi-directional thermal pathways, boosting both in-plane and through-plane thermal conductivity by 488.9% and 503.3% of the aramid nanofiber/boron nitride nanosheet, respectively, compared to random-gel densified films. Also, the aramid nanofiber/boron nitride nanosheet film exhibits high solar reflectivity, infrared emissivity, and thermal radiation, enabling efficient subambient cooling (17.2 °C at 100 mW/cm²) for heat-generating devices.

Suggested Citation

  • Gaojie Han & Hongli Cheng & Yuezhan Feng & Shiliang Zhang & Jingwen Dong & Bing Zhou & Xianhu Liu & Chuntai Liu & Guangming Tao & Changyu Shen, 2025. "Efficient thermal management of electronic devices by constructing interlayer phonon bridges," Nature Communications, Nature, vol. 16(1), pages 1-12, December.
    • Handle: RePEc:nat:natcom:v:16:y:2025:i:1:d:10.1038_s41467-025-65554-w
    DOI: 10.1038/s41467-025-65554-w
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