Author
Listed:
- Nicholas F. Mendez
(New York)
- Vivek Sharma
(Indian Institute of Technology Bombay)
- Michele Valsecchi
(New York)
- Vighnesh Pai
(New York)
- Johnny K. Lee
(New York)
- Linda S. Schadler
(University of Vermont)
- Alejandro J. Müller
(Paseo Manuel de Lardizabal 3
Plaza Euskadi 5)
- Shelby Watson-Sanders
(University of Tennessee Knoxville)
- Mark Dadmun
(University of Tennessee Knoxville)
- Guruswamy Kumaraswamy
(Indian Institute of Technology Bombay)
- Sanat K. Kumar
(New York)
Abstract
Polymers are known to spontaneously produce microplastics (sizes 1 μm – 3 mm) and nanoplastics (10 nm – 1 μm). Still, the mechanisms by which environmentally-triggered Å-level random bond breaking events lead to the formation of these relatively large fragments are unclear. Significantly, $$\approx$$ ≈ 70% of commercial polymers are semicrystalline, with a morphology comprised of alternating crystalline and amorphous layers, each tens of nanometers thick. It is well-accepted that chain scission events accumulate in the amorphous phase. We show that this leads to mechanical failure and the concurrent release of particulate nanoplastics comprised of polydisperse stacks of lamellae even under quiescent conditions. Noncrystalline analogs, which do not have a well-defined microstructure, do not form nanoplastics. While the amorphous phase of the semicrystalline nanoplastics continues to degrade, crystal fragments do not, and hence, they temporally persist in the environment. These results stress the critical role of polymer microstructure and fracture mechanics on particulate nanoplastic creation.
Suggested Citation
Nicholas F. Mendez & Vivek Sharma & Michele Valsecchi & Vighnesh Pai & Johnny K. Lee & Linda S. Schadler & Alejandro J. Müller & Shelby Watson-Sanders & Mark Dadmun & Guruswamy Kumaraswamy & Sanat K. , 2025.
"Mechanism of quiescent nanoplastic formation from semicrystalline polymers,"
Nature Communications, Nature, vol. 16(1), pages 1-11, December.
Handle:
RePEc:nat:natcom:v:16:y:2025:i:1:d:10.1038_s41467-025-58233-3
DOI: 10.1038/s41467-025-58233-3
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