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Research on the Production Scheduling Method of a Semiconductor Packaging Test Based With the Clustering Method

Author

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  • Zhonghua Han

    (Faculty of Information and Control Engineering, Shenyang Jianzhu University, Shenyang, China & Department of Digital Faculty, Shenyang Institute of Automation, Chinese Academy of Sciences, Beijing, China)

  • Quan Zhang

    (Faculty of Information and Control Engineering, Shenyang Jianzhu University, Shenyang, China)

  • Yongqing Jiang

    (Chongqing University, Chongqing, China)

  • Bin Duan

    (Shenyang Institute of Automation, Chinese Academy of Sciences, Beijing, China)

Abstract

In this article, the scheduling of modern industrial production is studied. The research on scheduling of semiconductor packaging and testing is put forward. A new solution of packaging and test scheduling based on dynamic optimization is proposed. The decomposition strategy is used to solve the problem of the encapsulation test scheduling problem. The complexity of the problem is reduced to ensure the consistency of optimization. In the method, an AP clustering algorithm is used to optimize the matching relationship between job and resource. The neural network method is used to solve the problem. The research of this project will fully combine the characteristics of packaging and testing production. In view of the existing production scheduling theory, there is a big gap to a semiconductor packaging and testing enterprises for the actual research background. This simulation experiments show that the method can be used on packaged production scheduling to provide a viable, effective method support.

Suggested Citation

  • Zhonghua Han & Quan Zhang & Yongqing Jiang & Bin Duan, 2019. "Research on the Production Scheduling Method of a Semiconductor Packaging Test Based With the Clustering Method," International Journal of Information Systems and Supply Chain Management (IJISSCM), IGI Global, vol. 12(2), pages 36-56, April.
    • Handle: RePEc:igg:jisscm:v:12:y:2019:i:2:p:36-56
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