IDEAS home Printed from https://ideas.repec.org/a/ids/ijetma/v14y2011i5-6p452-464.html
   My bibliography  Save this article

Simulation research on the influence of stress relaxation on plastic IC delamination during scrapped PCB disassembly

Author

Listed:
  • Danfeng Long
  • Dong Xiang
  • Yehong Dong
  • Guanghong Duan

Abstract

Functional reuse of Integrated Circuits (IC) is effective to recover electronic utilities. Interfacial delamination may occur when the ICs are disassembled from scrapped Printed Circuit Board (PCB) and reduce reusability. In delamination analysis, viscoelasticity of moulding compound is a non-ignorable property as it reduces the stress. It is the purpose of this research to analyse the effect of stress relaxation before and during the disassembly. Results demonstrate the Stress Free Temperature (SFT) of the plastic IC package is raised several centi-degrees by a reflow process and hardly changed by long-time relaxation at room temperature. Stress relaxation with different heating rates in the disassembly causes a tiny difference of Energy Release Rate (ERR). Based on the results, it is recommended that high heating rate is used when it is below SFT and otherwise moderate heating rate is used. Furthermore, low peak temperature is the most important to avoid delamination.

Suggested Citation

  • Danfeng Long & Dong Xiang & Yehong Dong & Guanghong Duan, 2011. "Simulation research on the influence of stress relaxation on plastic IC delamination during scrapped PCB disassembly," International Journal of Environmental Technology and Management, Inderscience Enterprises Ltd, vol. 14(5/6), pages 452-464.
    • Handle: RePEc:ids:ijetma:v:14:y:2011:i:5/6:p:452-464
    as

    Download full text from publisher

    File URL: http://www.inderscience.com/link.php?id=43517
    Download Restriction: Access to full text is restricted to subscribers.
    ---><---

    As the access to this document is restricted, you may want to search for a different version of it.

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:ids:ijetma:v:14:y:2011:i:5/6:p:452-464. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    We have no bibliographic references for this item. You can help adding them by using this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: Sarah Parker (email available below). General contact details of provider: http://www.inderscience.com/browse/index.php?journalID=11 .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.