IDEAS home Printed from https://ideas.repec.org/a/hin/jnlmpe/652306.html
   My bibliography  Save this article

Fractal Geometry-Based Hypergeometric Time Series Solution to the Hereditary Thermal Creep Model for the Contact of Rough Surfaces Using the Kelvin-Voigt Medium

Author

Listed:
  • Osama M. Abuzeid
  • Anas N. Al-Rabadi
  • Hashem S. Alkhaldi

Abstract

This paper aims at constructing a continuous hereditary creep model for the thermoviscoelastic contact of a rough punch and a smooth surface of a rigid half-space. The used model considers the rough surface as a function of the applied load and temperatures. The material of the rough punch surface is assumed to behave as Kelvin-Voigt viscoelastic material. Such a model uses elastic springs and viscous dashpots in parallel. The fractal-based punch surface is modelled using a deterministic Cantor structure. An asymptotic power law, deduced using approximate iterative relations, is used to express the punch surface creep which is a time-dependent inelastic deformation. The suggested law utilized the hypergeometric time series to relate the variables of creep as a function of remote forces, body temperatures, and time. The model is valid when the approach of punch surface and half space is in the order of the size of the surface roughness. The closed-form results are obtained for selected values of the system parameters; the fractal surface roughness and various material properties. The obtained results show good agreement with published experimental results, and the methodology can be further extended to other structures such as the Kelvin-Voigt medium within electronic circuits and systems.

Suggested Citation

  • Osama M. Abuzeid & Anas N. Al-Rabadi & Hashem S. Alkhaldi, 2010. "Fractal Geometry-Based Hypergeometric Time Series Solution to the Hereditary Thermal Creep Model for the Contact of Rough Surfaces Using the Kelvin-Voigt Medium," Mathematical Problems in Engineering, Hindawi, vol. 2010, pages 1-22, July.
  • Handle: RePEc:hin:jnlmpe:652306
    DOI: 10.1155/2010/652306
    as

    Download full text from publisher

    File URL: http://downloads.hindawi.com/journals/MPE/2010/652306.pdf
    Download Restriction: no

    File URL: http://downloads.hindawi.com/journals/MPE/2010/652306.xml
    Download Restriction: no

    File URL: https://libkey.io/10.1155/2010/652306?utm_source=ideas
    LibKey link: if access is restricted and if your library uses this service, LibKey will redirect you to where you can use your library subscription to access this item
    ---><---

    More about this item

    Statistics

    Access and download statistics

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:hin:jnlmpe:652306. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    We have no bibliographic references for this item. You can help adding them by using this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: Mohamed Abdelhakeem (email available below). General contact details of provider: https://www.hindawi.com .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.