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Sustainable Supply Chain Network Design with Carbon Footprint Consideration: A Case Study in China

Author

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  • Yue Jiang
  • Yang Zhao
  • Mengyuan Dong
  • Shuihua Han

Abstract

With the environment concern increasing, corporations are facing new challenges on carbon management in supply chain network. In this paper, environmental consideration is introduced to traditional supply chain management, and the sustainable supply chain (SSC) is designed considering carbon footprint. We develop a mixed integer linear programming (MILP) model to get the optimal decisions on partner selection, technology selection, and transportation mode selection, as well as material procurement, product supply, and recovery mode. For validating the model, a beverage company in China is used. We also analyze the impact of supply chain uncertainties such as carbon emission price and recovery rate of returned products on the decision of SSC design.

Suggested Citation

  • Yue Jiang & Yang Zhao & Mengyuan Dong & Shuihua Han, 2019. "Sustainable Supply Chain Network Design with Carbon Footprint Consideration: A Case Study in China," Mathematical Problems in Engineering, Hindawi, vol. 2019, pages 1-19, July.
  • Handle: RePEc:hin:jnlmpe:3162471
    DOI: 10.1155/2019/3162471
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    Cited by:

    1. Chia-Nan Wang & Nhat-Luong Nhieu & Yu-Chi Chung & Huynh-Tram Pham, 2021. "Multi-Objective Optimization Models for Sustainable Perishable Intermodal Multi-Product Networks with Delivery Time Window," Mathematics, MDPI, vol. 9(4), pages 1-25, February.
    2. Surendra Vikram Singh Padiyar & Vandana & Shiv Raj Singh & Dipti Singh & Mitali Sarkar & Bikash Koli Dey & Biswajit Sarkar, 2022. "Three-Echelon Supply Chain Management with Deteriorated Products under the Effect of Inflation," Mathematics, MDPI, vol. 11(1), pages 1-19, December.
    3. Dindayal Agrawal & Ashish Dwivedi & Anchal Patil & Sanjoy Kumar Paul, 2023. "Impediments of product recovery in circular supply chains: Implications for sustainable development," Sustainable Development, John Wiley & Sons, Ltd., vol. 31(3), pages 1618-1637, June.

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