IDEAS home Printed from https://ideas.repec.org/a/hin/jnddns/2996704.html
   My bibliography  Save this article

Liquidity, Credit Risk, and Their Interaction on the Spreads in China’s Corporate Bond Market

Author

Listed:
  • Zijian Wu
  • Baochen Yang
  • Yunpeng Su
  • Leonid Shaikhet

Abstract

This paper investigates the impact of multidimension liquidity, credit risk, and the interaction between liquidity and credit risk on corporate bond spreads based on a large transaction data set from July, 2006 to June, 2016, including the monthly data of 3716 bonds in China. Our main findings reveal that liquidity premiums are the main parts of corporate bond spreads. The interaction between liquidity and credit risk plays a significant role in determining corporate bond spreads. In addition, the differences between the interbank market and the exchange market have a significant impact on corporate bond spreads in normal period, and the interaction between liquidity and credit risk has an enhanced impact on corporate bond spreads during financial crisis. We also find that the interaction between liquidity and credit risk will increase with the increase of liquidity risk and credit risk and it is a time-varying dynamic process.

Suggested Citation

  • Zijian Wu & Baochen Yang & Yunpeng Su & Leonid Shaikhet, 2022. "Liquidity, Credit Risk, and Their Interaction on the Spreads in China’s Corporate Bond Market," Discrete Dynamics in Nature and Society, Hindawi, vol. 2022, pages 1-19, April.
  • Handle: RePEc:hin:jnddns:2996704
    DOI: 10.1155/2022/2996704
    as

    Download full text from publisher

    File URL: http://downloads.hindawi.com/journals/ddns/2022/2996704.pdf
    Download Restriction: no

    File URL: http://downloads.hindawi.com/journals/ddns/2022/2996704.xml
    Download Restriction: no

    File URL: https://libkey.io/10.1155/2022/2996704?utm_source=ideas
    LibKey link: if access is restricted and if your library uses this service, LibKey will redirect you to where you can use your library subscription to access this item
    ---><---

    More about this item

    Statistics

    Access and download statistics

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:hin:jnddns:2996704. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    We have no bibliographic references for this item. You can help adding them by using this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: Mohamed Abdelhakeem (email available below). General contact details of provider: https://www.hindawi.com .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.