Numerical Study on Optimization of Manifold Microchannel Heat Sink

Integrated circuits have become indispensable in modern society owing to their formidable computational power and high integration, finding extensive applications in critical fields such as artificial intelligence and new energy vehicles. However, continued increases in integration density and reductions in physical size lead to a significantly higher heat flux density, thereby posing major challenges for thermal management and overall chip reliability. To address these thermal challenges, this study introduces an optimized manifold microchannel design. A three-dimensional conjugate heat transfer model was developed, and computational fluid dynamics simulations were performed to analyze the thermal–hydraulic performance. To mitigate temperature non-uniformity, several strategies were implemented: adjusting channel widths, employing uneven inlet gaps, and incorporating micro-fins. Results demonstrate that the optimized configuration achieves a maximum temperature reduction of 7.7 K, with peak thermal stress decreasing from 55.29 MPa to 47 MPa, effectively improving temperature uniformity. This study confirms that the proposed optimized design significantly enhances overall thermal performance, thereby offering a reliable and effective strategy for advanced chip thermal management.