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Magnetron-Sputtered and Rapid-Thermally Annealed NiO:Cu Thin Films on 3D Porous Substrates for Supercapacitor Electrodes

Author

Listed:
  • Seongha Oh

    (Department of Electrical Engineering, Chosun University, Gwangju 61452, Republic of Korea)

  • Young-Kil Jun

    (Hydrogen Industry Team, Green Energy Institute, Mokpo 58656, Republic of Korea)

  • Nam-Hoon Kim

    (Department of Electrical Engineering, Chosun University, Gwangju 61452, Republic of Korea)

Abstract

The performance of NiO-based supercapacitor electrodes for energy storage systems was enhanced by doping Cu into NiO thin films (200 nm) using radio-frequency magnetron co-sputtering on 3D porous Ni foam substrates, followed by rapid thermal annealing. The Hall effect measurements demonstrated enhanced electrical conductivity, with resistivity values of 1.244 × 10 −4 Ω·cm. The 3D porous NiO:Cu electrodes significantly increased the specific capacitance and achieved a value of 1809.2 Fg −1 , with the NiO:Cu (10 at% Cu) thin films at a scan rate of 5 mVs −1 , which is a 2.67-fold increase compared with the undoped NiO films on a glass substrate. The 3D porous NiO:Cu electrodes significantly improved the electrochemical properties of the NiO-based electrode, which resulted in a higher specific capacitance for enhancing the energy storage performance during grid stabilization.

Suggested Citation

  • Seongha Oh & Young-Kil Jun & Nam-Hoon Kim, 2025. "Magnetron-Sputtered and Rapid-Thermally Annealed NiO:Cu Thin Films on 3D Porous Substrates for Supercapacitor Electrodes," Energies, MDPI, vol. 18(11), pages 1-13, May.
    • Handle: RePEc:gam:jeners:v:18:y:2025:i:11:p:2704-:d:1662590
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