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Numerical Analysis of Flow Boiling Characteristics of a Single Channel Heat Sink Subjected to Multiple Heat Sources

Author

Listed:
  • Jiyu Qian

    (Nanjing Research Institute of Electronics Technology, Nanjing 210094, China)

  • Rui Wang

    (Nanjing Research Institute of Electronics Technology, Nanjing 210094, China)

  • Tao Wei

    (Nanjing Research Institute of Electronics Technology, Nanjing 210094, China)

  • Hao Tang

    (MIIT Key Laboratory of Thermal Control of Electronic Equipment, School of Energy and Power Engineering, Nanjing University of Science and Technology, Nanjing 210094, China)

  • Dinghua Hu

    (MIIT Key Laboratory of Thermal Control of Electronic Equipment, School of Energy and Power Engineering, Nanjing University of Science and Technology, Nanjing 210094, China)

Abstract

High-power electronic devices with multiple heat sources often require temperature uniformity and to operate within their functional temperature range for optimal performance. Micro-channel cooling could satisfy the heat dissipation requirements, but it may cause temperature non-uniformity. In this paper, simulations are performed for different geometric parameters of the channel and the position of the heat source. The results show that a flattened channel can effectively reduce the heat source temperature, broadening the straight channel can reduce the flow resistance and enhance heat transfer, while widening the channel at the bend may lead to local dryness. Meanwhile, a thermal model is established to analyze the influence of the position of the heat source. The results also show that with the increase in the curved channel radius, the phenomenon of vapor–liquid separation becomes more obvious, the pressure drop decreases, but the heat transfer effect worsens.

Suggested Citation

  • Jiyu Qian & Rui Wang & Tao Wei & Hao Tang & Dinghua Hu, 2023. "Numerical Analysis of Flow Boiling Characteristics of a Single Channel Heat Sink Subjected to Multiple Heat Sources," Energies, MDPI, vol. 16(7), pages 1-16, March.
    • Handle: RePEc:gam:jeners:v:16:y:2023:i:7:p:3060-:d:1108975
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