IDEAS home Printed from https://ideas.repec.org/a/gam/jeners/v15y2022i2p635-d726373.html
   My bibliography  Save this article

Comparative Thermal Performances between Pumped Thermosyphon Loops with Different Condenser Configurations Using R245fa as Working Fluid

Author

Listed:
  • Shyy-Woei Chang

    (Department of Systems and Naval Mechatronic Engineering, National Cheng Kung University, No. 1, University Road, Tainan City 70101, Taiwan)

  • Yn-An Tsai

    (Department of Systems and Naval Mechatronic Engineering, National Cheng Kung University, No. 1, University Road, Tainan City 70101, Taiwan)

  • Cheng-Lin Tsai

    (Department of Systems and Naval Mechatronic Engineering, National Cheng Kung University, No. 1, University Road, Tainan City 70101, Taiwan)

Abstract

A pumped two-phase thermosyphon loop is broadly utilized to intensify the cooling duties of electronic chipsets/systems and the effectiveness for harvesting thermal energy. The configuration of a condenser not only affects the heat transfer in the condenser, but also has an effect on the saturation pressures during the boiling and condensation processes to alter the hydrothermal performance of a pumped thermosyphon loop. The influence of the condenser configuration on the hydrothermal performance of a pumped thermosyphon loop is rarely studied. The present study comparatively examined the thermal performances of two pumped thermosyphon loops with a conventional tube-fin condenser and the expansion-tank condenser. The thermodynamic cycles in pressure-temperature and pressure-enthalpy diagrams, Nusselt numbers of evaporator and condenser, thermal resistances and various performance indexes evaluated at constant pumping powers at the controlled through-flow Reynolds numbers, boiling numbers and condenser thermal resistances were measured. At the similar thermal loads, flow rates, and fluid entry temperatures of condenser, the operating pressure of the thermosyphon loop with expansion tank condenser was considerably reduced from that with tube fin condenser, leading to the lower saturation temperature for reducing the thermal resistance and the lesser pressure drop across the loop with a noticeable hydrothermal performance improvement. At the parametric conditions tested, the ratio of dimensionless overall thermal resistances between the loops with expansion tank condenser and tube fin condenser fell in the range of 0.81–0.99. When the loop performance was compared at a constant cooling airflow rate without considering the more pumping power consumption for the loop with tube fin condenser, the ranges of thermal resistance for the loops with expansion tank condenser and tube fin condenser were 0.13–0.21 (KW −1 ) and 0.15–0.23 (KW −1 ). The merit indices evaluating the comparative hydrothermal performances of evaporator, condenser and loop between the two looped thermosyphons highlighted the significance of condenser design and affirmed the performance improvement by changing tube fin condenser into expansion tank condenser. The empirical correlations of evaporator Nusselt number, condenser Nusselt number, and overall thermal resistance using Reynolds number, boiling number, and condenser thermal resistance as the controlling parameters were generated for relevant applications.

Suggested Citation

  • Shyy-Woei Chang & Yn-An Tsai & Cheng-Lin Tsai, 2022. "Comparative Thermal Performances between Pumped Thermosyphon Loops with Different Condenser Configurations Using R245fa as Working Fluid," Energies, MDPI, vol. 15(2), pages 1-32, January.
  • Handle: RePEc:gam:jeners:v:15:y:2022:i:2:p:635-:d:726373
    as

    Download full text from publisher

    File URL: https://www.mdpi.com/1996-1073/15/2/635/pdf
    Download Restriction: no

    File URL: https://www.mdpi.com/1996-1073/15/2/635/
    Download Restriction: no
    ---><---

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:gam:jeners:v:15:y:2022:i:2:p:635-:d:726373. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    We have no bibliographic references for this item. You can help adding them by using this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: MDPI Indexing Manager (email available below). General contact details of provider: https://www.mdpi.com .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.