IDEAS home Printed from https://ideas.repec.org/a/gam/jeners/v15y2022i22p8400-d968794.html
   My bibliography  Save this article

Analysis of Energy Dissipation on the Sealing Surface of Premium Connection Based on a Microslip Shear Layer Model

Author

Listed:
  • Yang Yu

    (School of Aeronautics, Northwestern Polytechnical University, Xi’an 710072, China)

  • Zhan Qu

    (College of Petroleum Engineering, Xi’an Shiyou University, Xi’an 710065, China)

  • Yihua Dou

    (Mechanical Engineering College, Xi’an Shiyou University, Xi’an 710065, China)

  • Yinping Cao

    (Mechanical Engineering College, Xi’an Shiyou University, Xi’an 710065, China)

Abstract

In high production gas wells, premium connections are subject to alternating loads and vibration excitation due to the change of fluid pressure exerted on the tubing string. The energy dissipation on the sealing surface of premium connections affects the sealing performance of premium connections. The present study proposes a new energy dissipation analysis method for the sealing performance of premium connections using a microslip shear layer mode, a novel technique to overcome and improve the limitations of existing analysis method of premium connections. In this paper, based on a microslip shear layer model, a vibration equilibrium equation of premium connection was established with the constraints of the taper of the sealing surface, the thread, and the torque shoulder. Then, the control equilibrium equations of the stick and microslip were derived, and the critical microslip tangential force and force–displacement hysteresis curves under different interface parameters were obtained by solving the equilibrium equations. The influence of different interface parameters on the energy dissipation of premium connection was discussed by using a standardized regression coefficient method. It was found that the friction coefficient influenced both the minimum and maximum microslip tangential forces, while the shear layer stiffness influenced only the minimum microslip tangential force. The greater the stiffness of the shear layer, the smaller the minimum microslip tangential force and the relative displacement of the contact surface, which made it easier to generate energy dissipation. The influence of the friction coefficient on energy dissipation was much greater than the stiffness of the shear layer. There was positive correlation between the friction coefficient and energy dissipation. While, there was a negative correlation between the stiffness of shear layer and energy dissipation. The results can provide a theoretical guide for micro sealing failure mechanism of premium connections under dynamic loads and expand the analysis method of metal seals.

Suggested Citation

  • Yang Yu & Zhan Qu & Yihua Dou & Yinping Cao, 2022. "Analysis of Energy Dissipation on the Sealing Surface of Premium Connection Based on a Microslip Shear Layer Model," Energies, MDPI, vol. 15(22), pages 1-16, November.
  • Handle: RePEc:gam:jeners:v:15:y:2022:i:22:p:8400-:d:968794
    as

    Download full text from publisher

    File URL: https://www.mdpi.com/1996-1073/15/22/8400/pdf
    Download Restriction: no

    File URL: https://www.mdpi.com/1996-1073/15/22/8400/
    Download Restriction: no
    ---><---

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:gam:jeners:v:15:y:2022:i:22:p:8400-:d:968794. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    We have no bibliographic references for this item. You can help adding them by using this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: MDPI Indexing Manager (email available below). General contact details of provider: https://www.mdpi.com .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.