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A 3D Thermal Network Model for Monitoring Imbalanced Thermal Distribution of Press-Pack IGBT Modules in MMC-HVDC Applications

Author

Listed:
  • Yao Chang

    (College of Electrical Engineering, Zhejiang University, Hangzhou 310027, China)

  • Wuhua Li

    (College of Electrical Engineering, Zhejiang University, Hangzhou 310027, China)

  • Haoze Luo

    (College of Electrical Engineering, Zhejiang University, Hangzhou 310027, China)

  • Xiangning He

    (College of Electrical Engineering, Zhejiang University, Hangzhou 310027, China)

  • Francesco Iannuzzo

    (Department of Energy Technology, Aalborg University, 9220 Aalborg, Denmark)

  • Frede Blaabjerg

    (Department of Energy Technology, Aalborg University, 9220 Aalborg, Denmark)

  • Weixing Lin

    (TBEA Sunoasis Company LTD., Urumchi 830011, China)

Abstract

In this paper, the impact of a double-sided press-pack insulated-gate-bipolar-transistor (PP IGBT) cooling structure on its thermal impedance distribution is studied and explored. A matrix thermal impedance network model is built by considering the multi-chip thermal coupling effect for the collector side of the PP IGBT. Moreover, a verification has been made by comparing the proposed matrix thermal network model and the conventional lumped RC network model provided by the manufacturer. It is concluded that the collector side has lower thermal resistance and dissipates about 88% of the heat generated by the IGBT chips inside the module. Then, a modular-multilevel-converter high-voltage-direct-current (MMC-HVDC)-based type test setup composed of the press-pack IGBT stacks is established and the junction temperature is calculated with the proposed thermal model and verified by temperature measurements.

Suggested Citation

  • Yao Chang & Wuhua Li & Haoze Luo & Xiangning He & Francesco Iannuzzo & Frede Blaabjerg & Weixing Lin, 2019. "A 3D Thermal Network Model for Monitoring Imbalanced Thermal Distribution of Press-Pack IGBT Modules in MMC-HVDC Applications," Energies, MDPI, vol. 12(7), pages 1-20, April.
    • Handle: RePEc:gam:jeners:v:12:y:2019:i:7:p:1319-:d:220443
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    Citations

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    Cited by:

    1. Krzysztof Górecki & Krzysztof Posobkiewicz, 2022. "Influence of a Cooling System on Power MOSFETs’ Thermal Parameters," Energies, MDPI, vol. 15(8), pages 1-20, April.
    2. Krzysztof Górecki & Krzysztof Posobkiewicz, 2022. "Cooling Systems of Power Semiconductor Devices—A Review," Energies, MDPI, vol. 15(13), pages 1-29, June.
    3. Guillermo Salinas & Juan A. Serrano-Vargas & Javier Muñoz-Antón & Pedro Alou, 2021. "Thermal Resistance Matrix Extraction from Finite-Element Analysis for High-Frequency Magnetic Components," Energies, MDPI, vol. 14(11), pages 1-14, May.

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