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A New Vertical JFET Power Device for Harsh Radiation Environments

Author

Listed:
  • Pablo Fernández-Martínez

    (Instituto de Microelectrónica de Barcelona, Centro Nacional de Microelectrónica (IMB-CNM, CSIC), Campus UAB, 08193 Bellaterra, Barcelona, Spain)

  • David Flores

    (Instituto de Microelectrónica de Barcelona, Centro Nacional de Microelectrónica (IMB-CNM, CSIC), Campus UAB, 08193 Bellaterra, Barcelona, Spain)

  • Salvador Hidalgo

    (Instituto de Microelectrónica de Barcelona, Centro Nacional de Microelectrónica (IMB-CNM, CSIC), Campus UAB, 08193 Bellaterra, Barcelona, Spain)

  • Xavier Jordà

    (Instituto de Microelectrónica de Barcelona, Centro Nacional de Microelectrónica (IMB-CNM, CSIC), Campus UAB, 08193 Bellaterra, Barcelona, Spain)

  • Xavier Perpiñà

    (Instituto de Microelectrónica de Barcelona, Centro Nacional de Microelectrónica (IMB-CNM, CSIC), Campus UAB, 08193 Bellaterra, Barcelona, Spain)

  • David Quirion

    (Instituto de Microelectrónica de Barcelona, Centro Nacional de Microelectrónica (IMB-CNM, CSIC), Campus UAB, 08193 Bellaterra, Barcelona, Spain)

  • Lucia Ré

    (Instituto de Microelectrónica de Barcelona, Centro Nacional de Microelectrónica (IMB-CNM, CSIC), Campus UAB, 08193 Bellaterra, Barcelona, Spain)

  • Miguel Ullán

    (Instituto de Microelectrónica de Barcelona, Centro Nacional de Microelectrónica (IMB-CNM, CSIC), Campus UAB, 08193 Bellaterra, Barcelona, Spain)

  • Miquel Vellvehí

    (Instituto de Microelectrónica de Barcelona, Centro Nacional de Microelectrónica (IMB-CNM, CSIC), Campus UAB, 08193 Bellaterra, Barcelona, Spain)

Abstract

An increasing demand for power electronic devices able to be operative in harsh radiation environments is now taking place. Specifically, in High Energy Physics experiments the required power devices are expected to withstand very high radiation levels which are normally too hard for most of the available commercial solutions. In this context, a new vertical junction field effect transistor (JFET) has been designed and fabricated at the Instituto de Microelectrónica de Barcelona, Centro Nacional de Microelectrónica (IMB-CNM, CSIC). The new silicon V-JFET devices draw upon a deep-trenched technology to achieve volume conduction and low switch-off voltage, together with a moderately high voltage capability. The first batches of V-JFET prototypes have been already fabricated at the IMB-CNM clean room, and several aspects of their design, fabrication and the outcome of their characterization are summarized and discussed in this paper. Radiation hardness of the fabricated transistors have been tested both with gamma and neutron irradiations, and the results are also included in the contribution.

Suggested Citation

  • Pablo Fernández-Martínez & David Flores & Salvador Hidalgo & Xavier Jordà & Xavier Perpiñà & David Quirion & Lucia Ré & Miguel Ullán & Miquel Vellvehí, 2017. "A New Vertical JFET Power Device for Harsh Radiation Environments," Energies, MDPI, vol. 10(2), pages 1-16, February.
  • Handle: RePEc:gam:jeners:v:10:y:2017:i:2:p:256-:d:90915
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    Cited by:

    1. Kamil Bargieł & Damian Bisewski & Janusz Zarębski, 2020. "Modelling of Dynamic Properties of Silicon Carbide Junction Field-Effect Transistors (JFETs)," Energies, MDPI, vol. 13(1), pages 1-9, January.

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