IDEAS home Printed from https://ideas.repec.org/a/fgv/eaerae/v64y2024i3a90701.html

Innovation efficiency, overseas experience of chief executive officer and firm value in chinese chip companies

Author

Listed:
  • Chen, Yung-Shuan

Abstract

This study examines the impact of CEO overseas experience and innovation efficiency on firm value. Using the propensity score matching technique with 645 observations from 129 Chinese chip companies listed from 2015 to 2019, we found that CEOs with overseas experience significantly increase firm value. Innovation efficiency has a significantly positive effect on firm value. Importantly, CEO overseas experience moderates theimpact of innovation efficiency on firm value, indicating that these CEOs are better able to leverage innovation for value creation. The results underscore the importance of attracting and retaining CEOs with overseas experience and enhancing innovation efficiency to stay competitive.The study has theoretical and policy implications for companies, policymakers, and industry stakeholders.

Suggested Citation

  • Chen, Yung-Shuan, 2024. "Innovation efficiency, overseas experience of chief executive officer and firm value in chinese chip companies," RAE - Revista de Administração de Empresas, FGV-EAESP Escola de Administração de Empresas de São Paulo (Brazil), vol. 64(3), February.
    • Handle: RePEc:fgv:eaerae:v:64:y:2024:i:3:a:90701
    as

    Download full text from publisher

    File URL: https://periodicos.fgv.br/rae/article/view/90701
    Download Restriction: no
    ---><---

    More about this item

    Statistics

    Access and download statistics

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:fgv:eaerae:v:64:y:2024:i:3:a:90701. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    We have no bibliographic references for this item. You can help adding them by using this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: Núcleo de Computação da FGV EPGE (email available below). General contact details of provider: https://edirc.repec.org/data/eagvfbr.html .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.