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Numerical Analysis of Adhesive Joints with Bi-Layered Adherends

Author

Listed:
  • Ahmed Hasan Sayegh

    (King Abdulaziz University, Saudi Arabia)

  • Khalid Almitani
  • Ramzi Othman

Abstract

Improvement of joint quality has always being a call for concern in an assembled component due to numerous application of such components in immense industrial sectors such as aerospace and automotive industries, electrical/electronic industries etc. With this in mind quite a vast research had been carried out and still on going to enhance the characteristics of various parts that makes up an assemble and the complete assemble itself. Part of the research carried out fixated on adhesive bonded joint of different geometrical designs such as L-shape, single-lap, double-lap, tubular, T-shaped, stepped and scarf joints etc. Focusing on single –lap joint due to the simplicity of the design geometry and their ease of fabrication, various forms of arrangement have been researched on. But owing to its untimely failure, caused by high strength concentration in the overlapping areas and some other parts that are delicate to peel damage various forms of design geometry have been adopted ranging from tapering, stepping and wavy lapping of overlapping layers in order to reduce or mitigate the stress concentration for an improved load bearing ability. Due to a lot of challenges being faced with difficulty in fabrication, this study focused on double layer single-lap joint. Its harmonic response when subjected to external dynamic loading was investigated with the use of Ansys finite element analysis. The numerical analysis was carried out on various forms of adhesive-adherends arrangement, and from the harmonic response obtained it showed that the double layer single-lap joint have improved load bearing capacity as compared with other geometrical designs.

Suggested Citation

  • Ahmed Hasan Sayegh & Khalid Almitani & Ramzi Othman, 2020. "Numerical Analysis of Adhesive Joints with Bi-Layered Adherends," European Journal of Engineering and Technology Research, European Open Science, vol. 5(6), pages 731-735, June.
  • Handle: RePEc:epw:ejeng0:v:5:y:2020:i:6:id:61959
    DOI: 10.24018/ejeng.2020.5.6.1959
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