Author
Abstract
Silicon-based power semiconductors are starting to show their limits as high-power, high-frequency electronics get more common in things like electric cars, renewable energy, data centers, and phone networks. Silicon just can't handle the high voltages, quick switching, and heat that these systems need. Wide bandgap (WBG) semiconductors look like a solution because they handle electricity and heat a lot better. This paper takes a look at silicon carbide (SiC) and gallium nitride (GaN) semiconductors and how they can power the next wave of electronics. We'll check out what makes them work well, like how much energy it takes to get electrons moving, how much electric field they can take, how fast electrons move through them, and how well they conduct heat. We'll also break down how SiC MOSFETs and GaN HEMTs work, looking at their designs. SiC devices are great for high-voltage, high-power jobs, while GaN devices shine in systems that need high frequency and pack a lot of power into a small space. Recent tests show SiC MOSFET converters hitting 98–99% efficiency, and GaN converters running at over 500 kHz with power densities over 50 kW/L [14–16]. We'll also look at where these materials are being put to work, like in electric car motors, renewable energy systems, power supplies, and phone networks, to show why they matter to industry. The paper also covers some of the current issues, like defects in the materials, how reliable the devices are, how tricky they are to make, and how much they cost. Besides that, we'll peek at some upcoming ultra-wide bandgap materials like gallium oxide and diamond, which might be used for super-high-voltage stuff in the future [19–20]. All in all, WBG semiconductors are going to be key in making power electronics more efficient, smaller, and able to handle heat in future energy and communication systems.
Suggested Citation
Download full text from publisher
Corrections
All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:bjf:ijltem:v:15:y:2026:i:2:a:2115. See general information about how to correct material in RePEc.
If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.
We have no bibliographic references for this item. You can help adding them by using this form .
If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.
For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: Dr. Pawan Verma (email available below). General contact details of provider: https://www.ijltemas.in/ .
Please note that corrections may take a couple of weeks to filter through
the various RePEc services.