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Physical Design Challenges and Solutions in Advanced Technology Nodes: A Comprehensive Analysis

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  • NaveenKumar Siddappa Desai

    (Marvell and Qualcomm, USA)

Abstract

This article presents a comprehensive analysis of physical design challenges and solutions in advanced technology nodes, focusing on the evolution from traditional planar transistors to FinFET and Gate-All-Around architectures. The article examines the complexities of design rule management, manufacturing constraints, and power optimization strategies in modern semiconductor design. Special attention is given to the revolutionary impact of Extreme Ultraviolet lithography and the integration of artificial intelligence and machine learning techniques in physical design workflows. The article highlights the critical role of advanced Process Design Kits and sophisticated power management strategies in addressing the increasing challenges of semiconductor scaling. Furthermore, the article demonstrates how AI-driven approaches are transforming traditional design methodologies, enabling more efficient design space exploration and optimization while maintaining quality objectives.

Suggested Citation

  • NaveenKumar Siddappa Desai, 2025. "Physical Design Challenges and Solutions in Advanced Technology Nodes: A Comprehensive Analysis," Journal of Computer Science and Technology Studies, Al-Kindi Center for Research and Development, vol. 7(7), pages 101-105, June.
    • Handle: RePEc:alk:jcsts0:v:7:y:2025:i:7:id:10197
    DOI: 10.32996/jcsts.2025.7.7.8
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