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Strengthening the Competitiveness and Sustainability of a Semiconductor Manufacturer with Cloud Manufacturing

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  • Toly Chen

    (Department of Industrial Engineering and Systems Management, Feng Chia University, 100, Wenhwa Road, Seatwen, Taichung City 407, Taiwan)

Abstract

Cloud manufacturing (CMfg) is a new-generation service-oriented networked manufacturing model that provides distributed users centralized managed manufacturing resources, ability, and services. CMfg is applied here to a semiconductor manufacturing factory. Benefits are classified into five aspects: cost savings, efficiency, additional data analysis capabilities, flexibility, and closer partner relationships. A strength, weakness, opportunity, and threat (SWOT) analysis is done which guides a semiconductor manufacturer in planning CMfg implementation projects. Simulation of a wafer fabrication factory (wafer fab) is used as an example. Several CMfg services are proposed for assisting the fab simulation activities through the collaboration of cloud service providers, software vendors, equipment suppliers, and the wafer fab. The connection with the competitiveness and sustainability of a wafer fab is also stressed.

Suggested Citation

  • Toly Chen, 2014. "Strengthening the Competitiveness and Sustainability of a Semiconductor Manufacturer with Cloud Manufacturing," Sustainability, MDPI, vol. 6(1), pages 1-16, January.
    • Handle: RePEc:gam:jsusta:v:6:y:2014:i:1:p:251-266:d:31877
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    References listed on IDEAS

    as
    1. Christoph Zott, 2003. "Dynamic capabilities and the emergence of intraindustry differential firm performance: insights from a simulation study," Strategic Management Journal, Wiley Blackwell, vol. 24(2), pages 97-125, February.
    2. Toly Chen, 2013. "A Systematic Cycle Time Reduction Procedure for Enhancing the Competitiveness and Sustainability of a Semiconductor Manufacturer," Sustainability, MDPI, vol. 5(11), pages 1-16, November.
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    Citations

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    Cited by:

    1. Toly Chen & Yu-Cheng Lin, 2017. "A digital equipment identifier system," Journal of Intelligent Manufacturing, Springer, vol. 28(5), pages 1159-1169, June.
    2. Toly Chen, 2016. "Competitive and Sustainable Manufacturing in the Age of Globalization," Sustainability, MDPI, vol. 9(1), pages 1-5, December.
    3. Taosheng Wang & Hongyan Zuo & C. H. Wu & B. Hu, 2021. "Combined soft measurement on key indicator parameters of new competitive advantages for China's export," Financial Innovation, Springer;Southwestern University of Finance and Economics, vol. 7(1), pages 1-24, December.
    4. Wei He & Guozhu Jia & Hengshan Zong & Jili Kong, 2019. "Multi-Objective Service Selection and Scheduling with Linguistic Preference in Cloud Manufacturing," Sustainability, MDPI, vol. 11(9), pages 1-15, May.
    5. Tin-Chih Toly Chen, 2017. "Cloud intelligence in manufacturing," Journal of Intelligent Manufacturing, Springer, vol. 28(5), pages 1057-1059, June.
    6. Toly Chen & Yi-Chi Wang & Zhirong Lin, 2017. "Predictive distant operation and virtual control of computer numerical control machines," Journal of Intelligent Manufacturing, Springer, vol. 28(5), pages 1061-1077, June.
    7. Toly Chen & Li-Chih Wang & Min-Chi Chiu, 2018. "A multi-granularity approach for estimating the sustainability of a factory simulation model: semiconductor packaging as an example," Operational Research, Springer, vol. 18(3), pages 711-729, October.
    8. Toly Chen & Chi-Wei Lin, 2017. "Estimating the simulation workload for factory simulation as a cloud service," Journal of Intelligent Manufacturing, Springer, vol. 28(5), pages 1139-1157, June.
    9. Lukasz Kuzminski & Tomasz Jalowiec & Piotr Masloch & Henryk Wojtaszek & Ireneusz Miciula, 2020. "Implementation of the Competitiveness Model in Terms of Cooperation with Suppliers," European Research Studies Journal, European Research Studies Journal, vol. 0(2), pages 343-359.
    10. Hsin-Chieh Wu & Horng-Ren Tsai & Tin-Chih Toly Chen & Keng-Wei Hsu, 2021. "Energy-Efficient Production Planning Using a Two-Stage Fuzzy Approach," Mathematics, MDPI, vol. 9(10), pages 1-17, May.

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