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Forced convective air-cooling of simulated printed-circuit boards

Author

Listed:
  • Tam, W. C.
  • Leung, C. W.
  • Probert, S. D.

Abstract

The considered assembly consisted of a simulated printed-circuit board (PCB), in this instance a horizontal, thermally insulting base with uniformly spaced rectangular copper bars--hereafter referred to as ribs, used to mimic the behaviour of electronic components--protruding upwards from the base. The assembly was mounted in a thermally well insulated, rectangular-sectioned duct, so that air could be sucked solely over the upper surface of the simulated PCB; the horizontal ribs were arranged to be orthogonal to the horizontal mean air-flow. Steady-state heat-transfer performance data, showing the influence of the geometry of the system, were measured. A non-dimensional correlation, which can be used by designers to predict the steady-state rate of heat transfer from such a PCB assembly to the air flow, is for 8·5 x 102

Suggested Citation

  • Tam, W. C. & Leung, C. W. & Probert, S. D., 1993. "Forced convective air-cooling of simulated printed-circuit boards," Applied Energy, Elsevier, vol. 46(3), pages 197-214.
  • Handle: RePEc:eee:appene:v:46:y:1993:i:3:p:197-214
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    Cited by:

    1. Leung, C. W. & Kang, H. J. & Probert, S. D., 1997. "Horizontal simulated printed-circuit board assembly in fully-developed laminar-flow convection," Applied Energy, Elsevier, vol. 56(1), pages 71-91, January.
    2. Leung, C. W. & Chan, T. L. & Probert, S. D. & Kang, H. J., 1999. "Forced convection from a horizontal ribbed rectangular base-plate penetrated by arrays of holes," Applied Energy, Elsevier, vol. 62(2), pages 81-95, February.

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