IDEAS home Printed from https://ideas.repec.org/a/eee/appene/v30y1988i1p53-60.html
   My bibliography  Save this article

Reducing the thermal resistance of a pressed contact

Author

Listed:
  • O'Callaghan, P. W.
  • Probert, S. D.

Abstract

The resistance to a heat flow passing across the interface between two surfaces which are pressed together, may be reduced by the presence of a relatively-soft interfacial insert of appropriate material and thickness. A computer-based mathematical model has been developed to predict the optimal thickness for this interfacial insert, which will minimise the thermal resistance of the contact assembly. The model has also been used to predict the behaviour of a joint formed between the flat surfaces of two, originally isothermal, cylindrical components, one of duralumin and the other of a titanium alloy. The predictions were validated (to within ±15%) by experimental measurements. For the particular systems studied, aluminium cooking foil, which is widely available, proved to be a superior insert to the more expensive, commerically advocated, thermal control materials for reducing contact resistances.

Suggested Citation

  • O'Callaghan, P. W. & Probert, S. D., 1988. "Reducing the thermal resistance of a pressed contact," Applied Energy, Elsevier, vol. 30(1), pages 53-60.
  • Handle: RePEc:eee:appene:v:30:y:1988:i:1:p:53-60
    as

    Download full text from publisher

    File URL: http://www.sciencedirect.com/science/article/pii/0306-2619(88)90054-2
    Download Restriction: Full text for ScienceDirect subscribers only
    ---><---

    As the access to this document is restricted, you may want to search for a different version of it.

    More about this item

    Statistics

    Access and download statistics

    Corrections

    All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:eee:appene:v:30:y:1988:i:1:p:53-60. See general information about how to correct material in RePEc.

    If you have authored this item and are not yet registered with RePEc, we encourage you to do it here. This allows to link your profile to this item. It also allows you to accept potential citations to this item that we are uncertain about.

    We have no bibliographic references for this item. You can help adding them by using this form .

    If you know of missing items citing this one, you can help us creating those links by adding the relevant references in the same way as above, for each refering item. If you are a registered author of this item, you may also want to check the "citations" tab in your RePEc Author Service profile, as there may be some citations waiting for confirmation.

    For technical questions regarding this item, or to correct its authors, title, abstract, bibliographic or download information, contact: Catherine Liu (email available below). General contact details of provider: http://www.elsevier.com/wps/find/journaldescription.cws_home/405891/description#description .

    Please note that corrections may take a couple of weeks to filter through the various RePEc services.

    IDEAS is a RePEc service. RePEc uses bibliographic data supplied by the respective publishers.